JPS5527267Y2 - - Google Patents
Info
- Publication number
- JPS5527267Y2 JPS5527267Y2 JP2462076U JP2462076U JPS5527267Y2 JP S5527267 Y2 JPS5527267 Y2 JP S5527267Y2 JP 2462076 U JP2462076 U JP 2462076U JP 2462076 U JP2462076 U JP 2462076U JP S5527267 Y2 JPS5527267 Y2 JP S5527267Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2462076U JPS5527267Y2 (https=) | 1976-03-02 | 1976-03-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2462076U JPS5527267Y2 (https=) | 1976-03-02 | 1976-03-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS52117257U JPS52117257U (https=) | 1977-09-06 |
| JPS5527267Y2 true JPS5527267Y2 (https=) | 1980-06-30 |
Family
ID=28484487
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2462076U Expired JPS5527267Y2 (https=) | 1976-03-02 | 1976-03-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5527267Y2 (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012064747A (ja) * | 2010-09-16 | 2012-03-29 | Nitto Denko Corp | 配線回路基板、配線回路基板集合体シートおよびその製造方法 |
| JP2014013949A (ja) * | 2013-10-25 | 2014-01-23 | Nitto Denko Corp | 配線回路基板集合体シートの製造方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0436146Y2 (https=) * | 1985-11-28 | 1992-08-26 |
-
1976
- 1976-03-02 JP JP2462076U patent/JPS5527267Y2/ja not_active Expired
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012064747A (ja) * | 2010-09-16 | 2012-03-29 | Nitto Denko Corp | 配線回路基板、配線回路基板集合体シートおよびその製造方法 |
| CN102404932A (zh) * | 2010-09-16 | 2012-04-04 | 日东电工株式会社 | 布线电路基板、布线电路基板集合体板及其制造方法 |
| US9313880B2 (en) | 2010-09-16 | 2016-04-12 | Nitto Denko Corporation | Printed circuit board, printed circuit board assembly sheet and method of manufacturing the same |
| JP2014013949A (ja) * | 2013-10-25 | 2014-01-23 | Nitto Denko Corp | 配線回路基板集合体シートの製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS52117257U (https=) | 1977-09-06 |