JPS5527254Y2 - - Google Patents
Info
- Publication number
- JPS5527254Y2 JPS5527254Y2 JP1975093592U JP9359275U JPS5527254Y2 JP S5527254 Y2 JPS5527254 Y2 JP S5527254Y2 JP 1975093592 U JP1975093592 U JP 1975093592U JP 9359275 U JP9359275 U JP 9359275U JP S5527254 Y2 JPS5527254 Y2 JP S5527254Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1975093592U JPS5527254Y2 (cg-RX-API-DMAC7.html) | 1975-07-03 | 1975-07-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1975093592U JPS5527254Y2 (cg-RX-API-DMAC7.html) | 1975-07-03 | 1975-07-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS527565U JPS527565U (cg-RX-API-DMAC7.html) | 1977-01-19 |
| JPS5527254Y2 true JPS5527254Y2 (cg-RX-API-DMAC7.html) | 1980-06-30 |
Family
ID=28575452
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1975093592U Expired JPS5527254Y2 (cg-RX-API-DMAC7.html) | 1975-07-03 | 1975-07-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5527254Y2 (cg-RX-API-DMAC7.html) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4953379A (cg-RX-API-DMAC7.html) * | 1972-09-27 | 1974-05-23 | ||
| JPS5856075B2 (ja) * | 1977-06-15 | 1983-12-13 | 静岡製機株式会社 | 自動乾燥機の停止制御回路 |
-
1975
- 1975-07-03 JP JP1975093592U patent/JPS5527254Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS527565U (cg-RX-API-DMAC7.html) | 1977-01-19 |