JPS5526704B2 - - Google Patents
Info
- Publication number
- JPS5526704B2 JPS5526704B2 JP11987074A JP11987074A JPS5526704B2 JP S5526704 B2 JPS5526704 B2 JP S5526704B2 JP 11987074 A JP11987074 A JP 11987074A JP 11987074 A JP11987074 A JP 11987074A JP S5526704 B2 JPS5526704 B2 JP S5526704B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/208—Multistep pretreatment with use of metal first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/285—Sensitising or activating with tin based compound or composition
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US40755573A | 1973-10-18 | 1973-10-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5067727A JPS5067727A (ja) | 1975-06-06 |
JPS5526704B2 true JPS5526704B2 (ja) | 1980-07-15 |
Family
ID=23612569
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11987074A Expired JPS5526704B2 (ja) | 1973-10-18 | 1974-10-16 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPS5526704B2 (ja) |
CA (1) | CA1058457A (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2409251C3 (de) * | 1974-02-22 | 1979-03-15 | Kollmorgen Corp., Hartford, Conn. (V.St.A.) | Verfahren zum katalytischen Bekeimen nichtmetallischer Oberflächen für eine nachfolgende, stromlose Metallisierung und Badlösungen zur Durchführung des Verfahrens |
ZA75566B (en) * | 1974-10-31 | 1976-01-28 | Kollmorgen Corp | Composition for sensitizing articles for metallization |
ZA75565B (en) * | 1974-10-31 | 1976-01-28 | Kollmorgen Corp | Process for sensitizing articles for metallization and resulting articles |
ZA77897B (en) * | 1976-04-13 | 1977-12-28 | Kollmorgen Corp | Liquid seeders and catalyzation processes for electroless metal deposition |
US4233344A (en) * | 1978-07-20 | 1980-11-11 | Learonal, Inc. | Method of improving the adhesion of electroless metal deposits employing colloidal copper activator |
JP6085833B2 (ja) * | 2012-07-04 | 2017-03-01 | 福井県 | 紙への無電解めっき方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4953133A (ja) * | 1972-07-11 | 1974-05-23 |
-
1974
- 1974-09-19 CA CA209,561A patent/CA1058457A/en not_active Expired
- 1974-10-16 JP JP11987074A patent/JPS5526704B2/ja not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4953133A (ja) * | 1972-07-11 | 1974-05-23 |
Also Published As
Publication number | Publication date |
---|---|
CA1058457A (en) | 1979-07-17 |
AU7363174A (en) | 1976-04-01 |
JPS5067727A (ja) | 1975-06-06 |