JPS5521223A - Extrusion die - Google Patents
Extrusion dieInfo
- Publication number
- JPS5521223A JPS5521223A JP9397878A JP9397878A JPS5521223A JP S5521223 A JPS5521223 A JP S5521223A JP 9397878 A JP9397878 A JP 9397878A JP 9397878 A JP9397878 A JP 9397878A JP S5521223 A JPS5521223 A JP S5521223A
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- edge
- resin passage
- manihold
- rooms
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001125 extrusion Methods 0.000 title abstract 2
- 239000011347 resin Substances 0.000 abstract 7
- 229920005989 resin Polymers 0.000 abstract 7
- 239000002184 metal Substances 0.000 abstract 6
- 239000002355 dual-layer Substances 0.000 abstract 3
- 239000010410 layer Substances 0.000 abstract 2
- 238000005192 partition Methods 0.000 abstract 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Extrusion Moulding Of Plastics Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9397878A JPS5521223A (en) | 1978-07-31 | 1978-07-31 | Extrusion die |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9397878A JPS5521223A (en) | 1978-07-31 | 1978-07-31 | Extrusion die |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5521223A true JPS5521223A (en) | 1980-02-15 |
Family
ID=14097481
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9397878A Pending JPS5521223A (en) | 1978-07-31 | 1978-07-31 | Extrusion die |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5521223A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6375767A (ja) * | 1986-09-19 | 1988-04-06 | Fujitsu Ltd | 現像剤供給装置における現像剤撹拌構造 |
-
1978
- 1978-07-31 JP JP9397878A patent/JPS5521223A/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6375767A (ja) * | 1986-09-19 | 1988-04-06 | Fujitsu Ltd | 現像剤供給装置における現像剤撹拌構造 |
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