JPS552106U - - Google Patents

Info

Publication number
JPS552106U
JPS552106U JP1978082799U JP8279978U JPS552106U JP S552106 U JPS552106 U JP S552106U JP 1978082799 U JP1978082799 U JP 1978082799U JP 8279978 U JP8279978 U JP 8279978U JP S552106 U JPS552106 U JP S552106U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1978082799U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1978082799U priority Critical patent/JPS552106U/ja
Priority to GB7919352A priority patent/GB2026235B/en
Priority to CA000329137A priority patent/CA1143822A/fr
Priority to FR7914341A priority patent/FR2428328A1/fr
Priority to DE19792922949 priority patent/DE2922949C2/de
Publication of JPS552106U publication Critical patent/JPS552106U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP1978082799U 1978-06-06 1978-06-15 Pending JPS552106U (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP1978082799U JPS552106U (fr) 1978-06-15 1978-06-15
GB7919352A GB2026235B (en) 1978-06-06 1979-06-04 Light emitting diode mounting structure for optical fibre communications
CA000329137A CA1143822A (fr) 1978-06-06 1979-06-05 Support de photodiode pour reseau de communication a fibres optiques
FR7914341A FR2428328A1 (fr) 1978-06-06 1979-06-05 Structure de montage pour ensemble a diode emettrice de lumiere pour telecommunications par fibres optiques
DE19792922949 DE2922949C2 (de) 1978-06-06 1979-06-06 Vorrichtung zum Anschluß wenigstens einer Licht emittierenden Diode an einen optischen Lichtleiter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1978082799U JPS552106U (fr) 1978-06-15 1978-06-15

Publications (1)

Publication Number Publication Date
JPS552106U true JPS552106U (fr) 1980-01-09

Family

ID=29003987

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1978082799U Pending JPS552106U (fr) 1978-06-06 1978-06-15

Country Status (1)

Country Link
JP (1) JPS552106U (fr)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5242390A (en) * 1975-09-30 1977-04-01 Nec Corp Semiconductor light receiving device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5242390A (en) * 1975-09-30 1977-04-01 Nec Corp Semiconductor light receiving device

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