JPS5520394B2 - - Google Patents
Info
- Publication number
- JPS5520394B2 JPS5520394B2 JP12652173A JP12652173A JPS5520394B2 JP S5520394 B2 JPS5520394 B2 JP S5520394B2 JP 12652173 A JP12652173 A JP 12652173A JP 12652173 A JP12652173 A JP 12652173A JP S5520394 B2 JPS5520394 B2 JP S5520394B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Laminated Bodies (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12652173A JPS5520394B2 (ja) | 1973-11-10 | 1973-11-10 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12652173A JPS5520394B2 (ja) | 1973-11-10 | 1973-11-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5076562A JPS5076562A (ja) | 1975-06-23 |
JPS5520394B2 true JPS5520394B2 (ja) | 1980-06-02 |
Family
ID=14937251
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12652173A Expired JPS5520394B2 (ja) | 1973-11-10 | 1973-11-10 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5520394B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2013153771A1 (ja) * | 2012-04-13 | 2015-12-17 | 日本発條株式会社 | 銅ベース回路基板 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5388160A (en) * | 1977-01-12 | 1978-08-03 | Hitachi Chemical Co Ltd | Method of insulating metal core for metal core contained printed circuit board |
JPS5693394A (en) * | 1979-12-26 | 1981-07-28 | Nitto Electric Ind Co | Powder material for metal core printed board |
US4489246A (en) * | 1980-12-24 | 1984-12-18 | Fujitsu Limited | Field effect transistor logic circuit having high operating speed and low power consumption |
JPS58165391A (ja) * | 1982-03-26 | 1983-09-30 | 昭和電工株式会社 | 印刷回路用基板 |
JPS58165392A (ja) * | 1982-03-26 | 1983-09-30 | 昭和電工株式会社 | 印刷回路用基板 |
JPS6034842A (ja) * | 1983-08-05 | 1985-02-22 | 住友ベークライト株式会社 | 金属ベ−ス銅張板 |
US5028984A (en) * | 1988-11-04 | 1991-07-02 | International Business Machines Corporation | Epoxy composition and use thereof |
US4960634A (en) * | 1990-03-14 | 1990-10-02 | International Business Machines Corporation | Epoxy composition of increased thermal conductivity and use thereof |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3704207A (en) * | 1970-04-21 | 1972-11-28 | Rca Corp | Process for forming an isolated circuit pattern on a conductive substrate |
-
1973
- 1973-11-10 JP JP12652173A patent/JPS5520394B2/ja not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3704207A (en) * | 1970-04-21 | 1972-11-28 | Rca Corp | Process for forming an isolated circuit pattern on a conductive substrate |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2013153771A1 (ja) * | 2012-04-13 | 2015-12-17 | 日本発條株式会社 | 銅ベース回路基板 |
Also Published As
Publication number | Publication date |
---|---|
JPS5076562A (ja) | 1975-06-23 |