JPS5519426B2 - - Google Patents
Info
- Publication number
- JPS5519426B2 JPS5519426B2 JP1259075A JP1259075A JPS5519426B2 JP S5519426 B2 JPS5519426 B2 JP S5519426B2 JP 1259075 A JP1259075 A JP 1259075A JP 1259075 A JP1259075 A JP 1259075A JP S5519426 B2 JPS5519426 B2 JP S5519426B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H10W72/90—
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H10W72/07551—
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- H10W72/50—
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- H10W72/5363—
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- H10W72/5522—
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- H10W72/59—
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- H10W72/934—
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- H10W72/952—
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- H10W74/00—
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- H10W90/756—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1259075A JPS5519426B2 (index.php) | 1975-01-31 | 1975-01-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1259075A JPS5519426B2 (index.php) | 1975-01-31 | 1975-01-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5187966A JPS5187966A (index.php) | 1976-07-31 |
| JPS5519426B2 true JPS5519426B2 (index.php) | 1980-05-26 |
Family
ID=11809556
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1259075A Expired JPS5519426B2 (index.php) | 1975-01-31 | 1975-01-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5519426B2 (index.php) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0260475U (index.php) * | 1988-08-24 | 1990-05-02 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62293627A (ja) * | 1986-06-12 | 1987-12-21 | Nec Corp | 半導体装置 |
-
1975
- 1975-01-31 JP JP1259075A patent/JPS5519426B2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0260475U (index.php) * | 1988-08-24 | 1990-05-02 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5187966A (index.php) | 1976-07-31 |