JPS5518592A - Improved adhesion of nonelectrolytic metal deposition layer - Google Patents

Improved adhesion of nonelectrolytic metal deposition layer

Info

Publication number
JPS5518592A
JPS5518592A JP9175479A JP9175479A JPS5518592A JP S5518592 A JPS5518592 A JP S5518592A JP 9175479 A JP9175479 A JP 9175479A JP 9175479 A JP9175479 A JP 9175479A JP S5518592 A JPS5518592 A JP S5518592A
Authority
JP
Japan
Prior art keywords
nonelectrolytic
deposition layer
metal deposition
improved adhesion
adhesion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9175479A
Other languages
English (en)
Japanese (ja)
Other versions
JPS636628B2 (en, 2012
Inventor
Robaato Burashiyu Uiriamu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shipley Co Inc
Original Assignee
LeaRonal Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LeaRonal Inc filed Critical LeaRonal Inc
Publication of JPS5518592A publication Critical patent/JPS5518592A/ja
Publication of JPS636628B2 publication Critical patent/JPS636628B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP9175479A 1978-07-20 1979-07-20 Improved adhesion of nonelectrolytic metal deposition layer Granted JPS5518592A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/926,392 US4233344A (en) 1978-07-20 1978-07-20 Method of improving the adhesion of electroless metal deposits employing colloidal copper activator

Publications (2)

Publication Number Publication Date
JPS5518592A true JPS5518592A (en) 1980-02-08
JPS636628B2 JPS636628B2 (en, 2012) 1988-02-10

Family

ID=25453141

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9175479A Granted JPS5518592A (en) 1978-07-20 1979-07-20 Improved adhesion of nonelectrolytic metal deposition layer

Country Status (4)

Country Link
US (1) US4233344A (en, 2012)
EP (1) EP0007577B1 (en, 2012)
JP (1) JPS5518592A (en, 2012)
DE (1) DE2967272D1 (en, 2012)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4847114A (en) * 1984-01-26 1989-07-11 Learonal, Inc. Preparation of printed circuit boards by selective metallization
US4759952A (en) * 1984-01-26 1988-07-26 Learonal, Inc. Process for printed circuit board manufacture
US4948707A (en) * 1988-02-16 1990-08-14 International Business Machines Corporation Conditioning a non-conductive substrate for subsequent selective deposition of a metal thereon
US4810332A (en) * 1988-07-21 1989-03-07 Microelectronics And Computer Technology Corporation Method of making an electrical multilayer copper interconnect
FR2646583B1 (fr) * 1989-05-01 1992-01-24 Enthone Corp Procede pour fabriquer des plaquettes a circuits imprimes
US5108786A (en) * 1989-05-01 1992-04-28 Enthone-Omi, Inc. Method of making printed circuit boards
US5071518A (en) * 1989-10-24 1991-12-10 Microelectronics And Computer Technology Corporation Method of making an electrical multilayer interconnect
US5011580A (en) * 1989-10-24 1991-04-30 Microelectronics And Computer Technology Corporation Method of reworking an electrical multilayer interconnect
US5015339A (en) * 1990-03-26 1991-05-14 Olin Hunt Sub Iii Corp. Process for preparing nonconductive substrates
US5143592A (en) * 1990-06-01 1992-09-01 Olin Corporation Process for preparing nonconductive substrates
JP4623774B2 (ja) * 1998-01-16 2011-02-02 住友電気工業株式会社 ヒートシンクおよびその製造方法
JP3229286B2 (ja) * 1999-04-02 2001-11-19 インターナショナル・ビジネス・マシーンズ・コーポレーション プリント回路基板の製造方法
GB0104503D0 (en) * 2001-02-23 2001-04-11 Shipley Co Llc Solvent swell for texturing resinous material and desmearing and removing resinous material
WO2014100096A1 (en) * 2012-12-18 2014-06-26 University Of South Florida Encapsulation of thermal energy storage media
CN105593410A (zh) * 2013-09-26 2016-05-18 德国艾托特克公司 用于衬底表面金属化的新颖粘着促进方法
CN117051387A (zh) * 2023-07-13 2023-11-14 深圳大学 一种芯片互连孔金属化活化剂及其制备方法与应用

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5067727A (en, 2012) * 1973-10-18 1975-06-06
JPS50129432A (en, 2012) * 1974-02-22 1975-10-13
JPS518127A (ja) * 1974-07-12 1976-01-22 Hitachi Ltd Mudenkaimetsukyomaeshorieki

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3011920A (en) * 1959-06-08 1961-12-05 Shipley Co Method of electroless deposition on a substrate and catalyst solution therefor
US3962494A (en) * 1971-07-29 1976-06-08 Photocircuits Division Of Kollmorgan Corporation Sensitized substrates for chemical metallization
CA1000453A (en) * 1972-07-11 1976-11-30 Francis J. Nuzzi Process and composition for sensitizing articles for metallization
US3884704A (en) * 1973-03-21 1975-05-20 Macdermid Inc Catalyst system for activating surfaces prior to electroless deposition
US4002778A (en) * 1973-08-15 1977-01-11 E. I. Du Pont De Nemours And Company Chemical plating process
US3993491A (en) * 1973-12-07 1976-11-23 Surface Technology, Inc. Electroless plating
US3993799A (en) * 1974-10-04 1976-11-23 Surface Technology, Inc. Electroless plating process employing non-noble metal hydrous oxide catalyst
US3982045A (en) * 1974-10-11 1976-09-21 Macdermid Incorporated Method of manufacture of additive printed circuitboards using permanent resist mask
US3962496A (en) * 1974-11-07 1976-06-08 Photocircuits Division Of Kollmorgen Composition and method for neutralizing and sensitizing resinous surfaces and improved sensitized resinous surfaces for adherent metallization
US4087586A (en) * 1975-12-29 1978-05-02 Nathan Feldstein Electroless metal deposition and article
US4042730A (en) * 1976-03-29 1977-08-16 Bell Telephone Laboratories, Incorporated Process for electroless plating using separate sensitization and activation steps
ZA77897B (en) * 1976-04-13 1977-12-28 Kollmorgen Corp Liquid seeders and catalyzation processes for electroless metal deposition
US4096043A (en) * 1977-07-11 1978-06-20 Western Electric Company, Inc. Method of selectively depositing a metal on a surface of a substrate

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5067727A (en, 2012) * 1973-10-18 1975-06-06
JPS50129432A (en, 2012) * 1974-02-22 1975-10-13
JPS518127A (ja) * 1974-07-12 1976-01-22 Hitachi Ltd Mudenkaimetsukyomaeshorieki

Also Published As

Publication number Publication date
JPS636628B2 (en, 2012) 1988-02-10
EP0007577A1 (en) 1980-02-06
US4233344A (en) 1980-11-11
DE2967272D1 (en) 1984-11-29
EP0007577B1 (en) 1984-10-24

Similar Documents

Publication Publication Date Title
GB2039678B (en) Deposition of films on substrates
JPS5773176A (en) Coating adhesion
JPS555997A (en) Formation of frosted coating layer
JPS5458736A (en) Method of depositing low surface energy coating layer
GB1554519A (en) Coating of substrates
JPS5518592A (en) Improved adhesion of nonelectrolytic metal deposition layer
JPS5475430A (en) Method of depositing metal on surface
DE3566088D1 (en) Treatment of a surface of a part to improve the adhesion of a coating deposited on the part particularly by hot projection
JPS5569249A (en) Nonelectrolytic deposition of transition metal
GB2070070B (en) Adhesion of metal coatings to solid substrates
DE3173905D1 (en) Coating of polymerical substrates
JPS5483640A (en) Continuous application of phosphate coating layer
JPS54103409A (en) Surface coated superhard alloy member
GB2032963B (en) Non-chromate conversion coating solutions
GB2078699B (en) Coating of metallic substrates
SG67986G (en) A device for measuring the tickness of a metal deposition layer
JPS5421409A (en) Method of making tungstenncarbide coating layer
JPS56128397A (en) Adhesion of vapor deposited film
GB8333355D0 (en) Metallic coating layer thickness
JPS53147738A (en) Coating of metal surface
JPS53115749A (en) Waterrproof coating layer
JPS54122322A (en) Producing selffcleaning type coating layer
JPS5585690A (en) Multilayerrhigh temperatureecorrosion resistant coating layer
JPS5580763A (en) Selffcleaning type coating layer
DE3277774D1 (en) Coating of substrates