JPS5518554A - Protective material for selective etching - Google Patents
Protective material for selective etchingInfo
- Publication number
- JPS5518554A JPS5518554A JP9047778A JP9047778A JPS5518554A JP S5518554 A JPS5518554 A JP S5518554A JP 9047778 A JP9047778 A JP 9047778A JP 9047778 A JP9047778 A JP 9047778A JP S5518554 A JPS5518554 A JP S5518554A
- Authority
- JP
- Japan
- Prior art keywords
- derivative
- protective material
- selective etching
- pts
- mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005530 etching Methods 0.000 title abstract 4
- 239000000463 material Substances 0.000 title abstract 4
- 230000001681 protective effect Effects 0.000 title abstract 3
- FMZUHGYZWYNSOA-VVBFYGJXSA-N (1r)-1-[(4r,4ar,8as)-2,6-diphenyl-4,4a,8,8a-tetrahydro-[1,3]dioxino[5,4-d][1,3]dioxin-4-yl]ethane-1,2-diol Chemical compound C([C@@H]1OC(O[C@@H]([C@@H]1O1)[C@H](O)CO)C=2C=CC=CC=2)OC1C1=CC=CC=C1 FMZUHGYZWYNSOA-VVBFYGJXSA-N 0.000 abstract 2
- 239000001913 cellulose Substances 0.000 abstract 2
- 229920002678 cellulose Polymers 0.000 abstract 2
- 238000010438 heat treatment Methods 0.000 abstract 2
- 238000007639 printing Methods 0.000 abstract 2
- 239000002904 solvent Substances 0.000 abstract 2
- 238000001035 drying Methods 0.000 abstract 1
- 230000001590 oxidative effect Effects 0.000 abstract 1
- 229920000058 polyacrylate Polymers 0.000 abstract 1
- 229920000193 polymethacrylate Polymers 0.000 abstract 1
- 229920002689 polyvinyl acetate Polymers 0.000 abstract 1
- 229920005992 thermoplastic resin Polymers 0.000 abstract 1
Landscapes
- Manufacturing Of Electric Cables (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Drying Of Semiconductors (AREA)
- Weting (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9047778A JPS5518554A (en) | 1978-07-26 | 1978-07-26 | Protective material for selective etching |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9047778A JPS5518554A (en) | 1978-07-26 | 1978-07-26 | Protective material for selective etching |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5518554A true JPS5518554A (en) | 1980-02-08 |
| JPS6227154B2 JPS6227154B2 (enrdf_load_stackoverflow) | 1987-06-12 |
Family
ID=13999652
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9047778A Granted JPS5518554A (en) | 1978-07-26 | 1978-07-26 | Protective material for selective etching |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5518554A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01316992A (ja) * | 1988-06-17 | 1989-12-21 | Mitsubishi Shindoh Co Ltd | 銅張積層配線板の製造方法 |
| CN103357346A (zh) * | 2013-06-27 | 2013-10-23 | 京东方科技集团股份有限公司 | 颜料分散剂、颜料分散液、彩色光刻胶及其制备和应用 |
| WO2025079352A1 (ja) * | 2023-10-13 | 2025-04-17 | 株式会社ダイセル | 低分子量セルロース誘導体の製造方法、エッチング処理された無機材料の製造方法 |
-
1978
- 1978-07-26 JP JP9047778A patent/JPS5518554A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01316992A (ja) * | 1988-06-17 | 1989-12-21 | Mitsubishi Shindoh Co Ltd | 銅張積層配線板の製造方法 |
| CN103357346A (zh) * | 2013-06-27 | 2013-10-23 | 京东方科技集团股份有限公司 | 颜料分散剂、颜料分散液、彩色光刻胶及其制备和应用 |
| WO2025079352A1 (ja) * | 2023-10-13 | 2025-04-17 | 株式会社ダイセル | 低分子量セルロース誘導体の製造方法、エッチング処理された無機材料の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6227154B2 (enrdf_load_stackoverflow) | 1987-06-12 |
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