JPS5518049B2 - - Google Patents

Info

Publication number
JPS5518049B2
JPS5518049B2 JP1345076A JP1345076A JPS5518049B2 JP S5518049 B2 JPS5518049 B2 JP S5518049B2 JP 1345076 A JP1345076 A JP 1345076A JP 1345076 A JP1345076 A JP 1345076A JP S5518049 B2 JPS5518049 B2 JP S5518049B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1345076A
Other versions
JPS5296867A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1345076A priority Critical patent/JPS5296867A/ja
Publication of JPS5296867A publication Critical patent/JPS5296867A/ja
Publication of JPS5518049B2 publication Critical patent/JPS5518049B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/03—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/03—Manufacturing methods
    • H01L2224/034—Manufacturing methods by blanket deposition of the material of the bonding area
    • H01L2224/03444—Manufacturing methods by blanket deposition of the material of the bonding area in gaseous form
    • H01L2224/0345—Physical vapour deposition [PVD], e.g. evaporation, or sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Wire Bonding (AREA)
JP1345076A 1976-02-10 1976-02-10 Semiconductor unit and its manufacture Granted JPS5296867A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1345076A JPS5296867A (en) 1976-02-10 1976-02-10 Semiconductor unit and its manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1345076A JPS5296867A (en) 1976-02-10 1976-02-10 Semiconductor unit and its manufacture

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP14262579A Division JPS55108733A (en) 1979-11-01 1979-11-01 Method of manufacture of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5296867A JPS5296867A (en) 1977-08-15
JPS5518049B2 true JPS5518049B2 (ja) 1980-05-16

Family

ID=11833465

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1345076A Granted JPS5296867A (en) 1976-02-10 1976-02-10 Semiconductor unit and its manufacture

Country Status (1)

Country Link
JP (1) JPS5296867A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62172032U (ja) * 1986-03-25 1987-10-31

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62172032U (ja) * 1986-03-25 1987-10-31

Also Published As

Publication number Publication date
JPS5296867A (en) 1977-08-15

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