JPS55176566U - - Google Patents

Info

Publication number
JPS55176566U
JPS55176566U JP1979076336U JP7633679U JPS55176566U JP S55176566 U JPS55176566 U JP S55176566U JP 1979076336 U JP1979076336 U JP 1979076336U JP 7633679 U JP7633679 U JP 7633679U JP S55176566 U JPS55176566 U JP S55176566U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1979076336U
Other languages
Japanese (ja)
Other versions
JPS6314468Y2 (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1979076336U priority Critical patent/JPS6314468Y2/ja
Publication of JPS55176566U publication Critical patent/JPS55176566U/ja
Application granted granted Critical
Publication of JPS6314468Y2 publication Critical patent/JPS6314468Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/33Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H01L2224/331Disposition
    • H01L2224/3318Disposition being disposed on at least two different sides of the body, e.g. dual array
    • H01L2224/33181On opposite sides of the body

Landscapes

  • Die Bonding (AREA)
JP1979076336U 1979-06-05 1979-06-05 Expired JPS6314468Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1979076336U JPS6314468Y2 (enExample) 1979-06-05 1979-06-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1979076336U JPS6314468Y2 (enExample) 1979-06-05 1979-06-05

Publications (2)

Publication Number Publication Date
JPS55176566U true JPS55176566U (enExample) 1980-12-18
JPS6314468Y2 JPS6314468Y2 (enExample) 1988-04-22

Family

ID=29309837

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1979076336U Expired JPS6314468Y2 (enExample) 1979-06-05 1979-06-05

Country Status (1)

Country Link
JP (1) JPS6314468Y2 (enExample)

Also Published As

Publication number Publication date
JPS6314468Y2 (enExample) 1988-04-22

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