JPS55175242U - - Google Patents
Info
- Publication number
- JPS55175242U JPS55175242U JP7626879U JP7626879U JPS55175242U JP S55175242 U JPS55175242 U JP S55175242U JP 7626879 U JP7626879 U JP 7626879U JP 7626879 U JP7626879 U JP 7626879U JP S55175242 U JPS55175242 U JP S55175242U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
- H01L2924/10158—Shape being other than a cuboid at the passive surface
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7626879U JPS55175242U (de) | 1979-06-04 | 1979-06-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7626879U JPS55175242U (de) | 1979-06-04 | 1979-06-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS55175242U true JPS55175242U (de) | 1980-12-16 |
Family
ID=29309774
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7626879U Pending JPS55175242U (de) | 1979-06-04 | 1979-06-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55175242U (de) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57190311A (en) * | 1981-05-08 | 1982-11-22 | Europ Composants Electron | Device for connecting electric part |
| JPS5842244A (ja) * | 1981-08-20 | 1983-03-11 | シ−メンス・アクチエンゲゼルシヤフト | 半導体チツプとその支持体との結合方法 |
| JP2005142224A (ja) * | 2003-11-04 | 2005-06-02 | Denso Corp | 半導体レーザ素子の実装方法 |
-
1979
- 1979-06-04 JP JP7626879U patent/JPS55175242U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57190311A (en) * | 1981-05-08 | 1982-11-22 | Europ Composants Electron | Device for connecting electric part |
| JPS5842244A (ja) * | 1981-08-20 | 1983-03-11 | シ−メンス・アクチエンゲゼルシヤフト | 半導体チツプとその支持体との結合方法 |
| JPH0230576B2 (de) * | 1981-08-20 | 1990-07-06 | Siemens Ag | |
| JP2005142224A (ja) * | 2003-11-04 | 2005-06-02 | Denso Corp | 半導体レーザ素子の実装方法 |