JPS55165644A - Electronic device - Google Patents

Electronic device

Info

Publication number
JPS55165644A
JPS55165644A JP6004180A JP6004180A JPS55165644A JP S55165644 A JPS55165644 A JP S55165644A JP 6004180 A JP6004180 A JP 6004180A JP 6004180 A JP6004180 A JP 6004180A JP S55165644 A JPS55165644 A JP S55165644A
Authority
JP
Japan
Prior art keywords
electronic device
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6004180A
Other languages
English (en)
Inventor
Sutatsufuaa Shieregeru Aaru
Jiyon Peeji Deritsuku
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CBS Corp
Original Assignee
Westinghouse Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Electric Corp filed Critical Westinghouse Electric Corp
Publication of JPS55165644A publication Critical patent/JPS55165644A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01025—Manganese [Mn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
    • H01L2924/13033—TRIAC - Triode for Alternating Current - A bidirectional switching device containing two thyristor structures with common gate contact

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
JP6004180A 1979-05-08 1980-05-08 Electronic device Pending JPS55165644A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/037,090 US4313128A (en) 1979-05-08 1979-05-08 Compression bonded electronic device comprising a plurality of discrete semiconductor devices

Publications (1)

Publication Number Publication Date
JPS55165644A true JPS55165644A (en) 1980-12-24

Family

ID=21892392

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6004180A Pending JPS55165644A (en) 1979-05-08 1980-05-08 Electronic device

Country Status (2)

Country Link
US (1) US4313128A (ja)
JP (1) JPS55165644A (ja)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5949709B2 (ja) * 1979-10-13 1984-12-04 三菱電機株式会社 光点弧サイリスタ装置
DE3005313C2 (de) * 1980-02-13 1986-05-28 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleiteranordnung
DE3245762A1 (de) * 1982-03-13 1983-09-22 Brown, Boveri & Cie Ag, 6800 Mannheim Halbleiterbauelement in modulbauweise
EP0088924A3 (de) * 1982-03-13 1985-10-23 BROWN, BOVERI & CIE Aktiengesellschaft Halbleiterbauelement in Modulbauweise
EP0100626A3 (en) * 1982-07-29 1985-11-06 LUCAS INDUSTRIES public limited company Semi-conductor assembly
US4646131A (en) * 1983-01-28 1987-02-24 Mitsubishi Denki Kabushiki Kaisha Rectifier device
DE3406538A1 (de) * 1984-02-23 1985-08-29 Bbc Brown Boveri & Cie Leistungshalbleitermodul und verfahren zur herstellung
ATE32483T1 (de) * 1984-07-12 1988-02-15 Siemens Ag Halbleiter-leistungsschalter mit thyristor.
US4614964A (en) * 1984-08-15 1986-09-30 Sundstrand Corporation Coaxial semiconductor package
US4985752A (en) * 1988-08-01 1991-01-15 Sundstrand Corporation Hermetically sealed compression bonded circuit assembly having a suspension for compression bonded semiconductor elements
US4830979A (en) * 1988-08-01 1989-05-16 Sundstrand Corp. Method of manufacturing hermetically sealed compression bonded circuit assemblies
US5034803A (en) * 1988-08-01 1991-07-23 Sundstrand Corporation Compression bonded semiconductor device having a plurality of stacked hermetically sealed circuit assemblies
US4954876A (en) * 1988-08-01 1990-09-04 Sundstrand Corporation Hermetically sealed compression bonded circuit assembly having flexible walls at points of application of pressure for compression bonding circuit elements
US5040051A (en) * 1988-12-05 1991-08-13 Sundstrand Corporation Hydrostatic clamp and method for compression type power semiconductors
US4999311A (en) * 1989-08-16 1991-03-12 Unisys Corporation Method of fabricating interconnections to I/O leads on layered electronic assemblies
DE59107655D1 (de) * 1991-02-22 1996-05-09 Asea Brown Boveri Abschaltbares Hochleistungs-Halbleiterbauelement
JP3180863B2 (ja) * 1993-07-27 2001-06-25 富士電機株式会社 加圧接触形半導体装置およびその組立方法
JP2991010B2 (ja) * 1993-09-29 1999-12-20 富士電機株式会社 半導体装置およびその製造方法
DE102006027481C5 (de) * 2006-06-14 2012-11-08 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit gegeneinander elektrisch isolierten Anschlusselementen
JP4400662B2 (ja) * 2007-09-12 2010-01-20 株式会社デンソー 電子回路部品実装構造
US20100038774A1 (en) * 2008-08-18 2010-02-18 General Electric Company Advanced and integrated cooling for press-packages
US7817422B2 (en) * 2008-08-18 2010-10-19 General Electric Company Heat sink and cooling and packaging stack for press-packages
US8120915B2 (en) * 2008-08-18 2012-02-21 General Electric Company Integral heat sink with spiral manifolds
US8218320B2 (en) 2010-06-29 2012-07-10 General Electric Company Heat sinks with C-shaped manifolds and millichannel cooling

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4881479A (ja) * 1972-01-31 1973-10-31
JPS50115773A (ja) * 1974-02-07 1975-09-10

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1539671A1 (de) * 1965-12-30 1969-12-18 Asea Ab Thyristorventil
GB1191887A (en) * 1966-09-02 1970-05-13 Gen Electric Semiconductor Rectifier Assemblies
US3532941A (en) * 1967-05-23 1970-10-06 Int Rectifier Corp Pressure-assembled semiconductor device having a plurality of semiconductor wafers
US3483444A (en) * 1967-12-06 1969-12-09 Int Rectifier Corp Common housing for independent semiconductor devices
GB1255749A (en) * 1969-04-30 1971-12-01 Westinghouse Brake & Signal Semiconductor devices
US3723836A (en) * 1972-03-15 1973-03-27 Motorola Inc High power semiconductor device included in a standard outline housing
US3902774A (en) * 1974-08-22 1975-09-02 Westinghouse Electric Corp Force equalizing system
US3916435A (en) * 1974-09-09 1975-10-28 Gen Motors Corp Heat sink assembly for button diode rectifiers
US4035831A (en) * 1975-04-17 1977-07-12 Agency Of Industrial Science & Technology Radial emitter pressure contact type semiconductor devices
CH601918A5 (ja) * 1976-09-29 1978-07-14 Schlatter Ag
DE2728313A1 (de) * 1977-06-23 1979-01-04 Siemens Ag Halbleiterbauelement
US4160992A (en) * 1977-09-14 1979-07-10 Raytheon Company Plural semiconductor devices mounted between plural heat sinks
US4224663A (en) * 1979-02-01 1980-09-23 Power Control Corporation Mounting assembly for semiconductive controlled rectifiers

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4881479A (ja) * 1972-01-31 1973-10-31
JPS50115773A (ja) * 1974-02-07 1975-09-10

Also Published As

Publication number Publication date
US4313128A (en) 1982-01-26

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