JPS5516524B2 - - Google Patents
Info
- Publication number
- JPS5516524B2 JPS5516524B2 JP4157976A JP4157976A JPS5516524B2 JP S5516524 B2 JPS5516524 B2 JP S5516524B2 JP 4157976 A JP4157976 A JP 4157976A JP 4157976 A JP4157976 A JP 4157976A JP S5516524 B2 JPS5516524 B2 JP S5516524B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4157976A JPS52124160A (en) | 1976-04-12 | 1976-04-12 | Method of manufacturing electronic parts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4157976A JPS52124160A (en) | 1976-04-12 | 1976-04-12 | Method of manufacturing electronic parts |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS52124160A JPS52124160A (en) | 1977-10-18 |
JPS5516524B2 true JPS5516524B2 (en) | 1980-05-02 |
Family
ID=12612345
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4157976A Granted JPS52124160A (en) | 1976-04-12 | 1976-04-12 | Method of manufacturing electronic parts |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS52124160A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01182711A (en) * | 1988-01-14 | 1989-07-20 | Nippon Telegr & Teleph Corp <Ntt> | Method and apparatus for measuring thickness of semiconductor layer |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5843529A (en) * | 1981-09-08 | 1983-03-14 | Hitachi Chem Co Ltd | Manufacture of humidity insulated hybrid ic |
JPS59113609A (en) * | 1982-12-20 | 1984-06-30 | 日立コンデンサ株式会社 | Method of producing molded condenser |
JPH0620033B2 (en) * | 1988-05-25 | 1994-03-16 | ニッセイ電機株式会社 | Electronic component manufacturing method |
-
1976
- 1976-04-12 JP JP4157976A patent/JPS52124160A/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01182711A (en) * | 1988-01-14 | 1989-07-20 | Nippon Telegr & Teleph Corp <Ntt> | Method and apparatus for measuring thickness of semiconductor layer |
Also Published As
Publication number | Publication date |
---|---|
JPS52124160A (en) | 1977-10-18 |