JPH0620033B2 - Electronic component manufacturing method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION <Field of Industrial Application> The present invention relates to a technology for manufacturing electronic components such as film capacitors.

<Prior Art> As is well known, electronic components such as film capacitors have recently become smaller and smaller, and have contributed greatly to the compactness of electronic components and high-density mounting technology (SMTD). However, these have led to the development of manufacturing technology and the improvement of quality.

It is preferable that such an electronic component suitable for high-density mounting can be accurately placed at a predetermined place in a limited mounting space such as a printed wiring board, and the size and shape of each component are uniform. It is desired that the precision is high, that is, the outer shape is well-balanced.

Therefore, for film capacitors, for example, use a case exterior type in which the element is placed in a case made of polycarbonate, polypropylene, etc., and the case is filled and sealed with resin such as epoxy, or a molding die is used. It is easy to make the shape uniform in terms of external dimensions, such as a mold shape in which the resin is compression-molded and then packaged. FIG. 13 is a block diagram showing an example of a conventional manufacturing process of a film capacitor in which a case is used for resin coating. In this case, first, a film capacitor element equipped with a lead wire (hereinafter simply referred to as an element) is pre-impregnated with a resin such as an epoxy resin having a relatively low viscosity in a decompressed atmosphere, and is then heat-cured once. , The element is stored in the case. At this time, the lead wire is locked to the case in advance so that the element does not move in the case, or the element is set to a predetermined one in the case by another member. Then, pour thermosetting resin into the case, heat and cure the resin,
Uniform capacitors with well-defined outer dimensions are made.

<Problems to be Solved by the Invention> However, in the conventional manufacturing method as described above, the impregnation of the element and the resin filling for the exterior are separately performed in different steps. The manufacturing process is complicated, for example, the heating process for curing is performed at least twice. In addition, when the resin is filled in the case, the work efficiency and the mass productivity are not good because the case is arranged for each case containing the element by the ejector or the cases are arranged and poured in order. It was Further, the case shape has a problem that the case itself is easily deformed if it is thin, and if a thick case is used, the case must be enlarged accordingly.

Therefore, the present invention has been made in view of the above-mentioned problems, and in the manufacturing process of electronic components, shaping is performed using a casting mold without using a case, which is small, inexpensive, and excellent in quality. The purpose is to manufacture electronic parts efficiently.

<Means for Solving the Problems> In order to achieve the above object, the present invention has a structure in which at least one electronic component element is contained and is made of a material having a high releasability, as shown in the block diagram of FIG. The above-mentioned elements are housed in a mold, and these are immersed together with a mold in a resin having a thermosetting property, an ultraviolet curable property, or a thermosetting property and an ultraviolet curable property in the air or a reduced pressure atmosphere, and the resin is placed in the mold. After filling, the mold is pulled up from the resin and either one of heating and ultraviolet irradiation is independently applied, or both are added for an arbitrary predetermined time to cure, and then the exterior element is basically removed. It has a feature.

<Operation> In the case of manufacturing an electronic component such as a capacitor according to the above method, if the process is performed according to the process shown in the block diagram of FIG. (The same applies below for the type that you insert and use.)
Also, it can be applied to both surface mount type parts. First, when manufacturing a lead-lead insertion type part, the lead-lead type element is also used in the element itself. When holding this in the mold, a large number are arranged on a jig and each lead wire is fixed with an adhesive tape. To do. In order to hold each element in the mold, it is necessary to hold and dispose the element and the inner surface of the mold with a predetermined gap, and to fix the element so as not to contact the mold.
In addition, in order to enhance the impregnation curing when immersed in the resin,
In general, it is effective to reduce the pressure with a vacuum pump or the like and perform it in an environment lower than atmospheric pressure.

Then, when curing the resin, if it is a thermosetting resin, all that is required is to pass through a heating furnace, but in the case of an ultraviolet curable resin, the entire glass or ultraviolet It is possible to completely cure the resin to the inside by using an aluminum material or the like having a glass window on the wall surface through which the resin penetrates and irradiating ultraviolet rays from outside. If the resin has both heat and ultraviolet curing properties, heating and ultraviolet irradiation are used together. The exterior element is removed from the mold after the resin is cured, but the exterior element can be easily taken out by opening the mold so that it can be divided into two parts or having an open / close structure.

When manufacturing the surface mount type, the element itself may be either a leadless type or a lead-lead type, and an appropriate part of the element is fixed to the inside of the die by a temporary fixing. Or, provide a place to hold on the mold side.
As a result, it is possible to obtain the same operational effects as in the case of the lead-out lead insertion type.

<Example> Hereinafter, an example of the present invention will be described with reference to Figs.

Embodiment 1 FIGS. 2 to 8 show a first embodiment, in which 1 is a film capacitor element (hereinafter simply referred to as element), 2 is a lead wire, and 3 is a casting mold. 4 is a resin.

In the element 1, the strip-shaped metallized films are laminated in multiple layers by winding or the like, and metal spraying (metallikon) is applied to both ends of the metallized film to individually cut the mother element provided with the metallikon layer 5. As shown in FIG. 2, lead wires 2 are welded to the metallikon layer 5, respectively.

As shown in FIG. 3, the mold 3 is made of a heat-resistant resin that is Teflon-coated or a metal such as aluminum that is Teflon-coated. The structure has a rounded upper part and is partitioned according to the size of the element 1. It has a long box shape with a partition wall 6,
It is formed so that it can be opened and closed as shown by the chain line in the figure with the lower ends of both ends in the longitudinal direction as fulcrums. Then, by providing the indicator rods 7 on both ends of the mold 3,
It is fixed to a jig 8 as shown in FIG. 4 so that a certain gap is formed between the jig 8 and the element 1. In addition to Teflon processing beforehand, applying a release agent on the inside during use makes it easier to remove parts.

Resin 4 uses a relatively low viscosity and good permeability,
An appropriate amount is stored in the resin tank 9 as shown in FIG.

Next, the manufacturing process will be described. First, the element 1
As shown in the figure, several jigs 8 are arranged and mounted at regular intervals. At this time, the element 1 fixes the lead wire 2 with the adhesive tape 10. Then, the element body 11 is housed so as to be fitted to each of the compartments 12 of the mold 3 individually. After that, a large number of these elements 1 are immersed in the resin tank 9 together with the mold 3 in the air or in a depressurized atmosphere reduced to a predetermined atmospheric pressure. FIG. 5 shows the immersed state, by which the element 1 is impregnated with the resin and the mold 3 for the exterior is filled with the resin at one time. The immersion time at this time is the element 1
It depends on the size of the resin or the viscosity state of the resin and is set to the optimum state. After a lapse of a predetermined time, the element 1 is pulled up together with the mold 3 from the resin tank 9, and as shown in FIG. 6, the temperature and time required for curing by the heater 13 are kept in an oven heated to, for example, about 120 ° C. The resin 4 is allowed to cure for about a period of time. After the curing, as shown in the side view of FIG. 7, the mold 3 is opened, and the impregnated and packaged finished capacitor C is taken out from the mold 3. FIG. 8 shows a film capacitor C whose outer dimensions are made extremely uniform in this way.

The film capacitor C can be directly attached to the printed wiring board without forming the lead wire 2, but may be formed.

Example 2: 2 In the first example, a thermosetting resin was used as the resin for impregnation and the exterior, but here, a case where an ultraviolet curable resin, for example, an acrem resin is used. explain. The element 1 is the same as that of the first embodiment, and the mold 3 is made of glass or transparent heat-resistant resin as shown in FIG. The manufacturing process is the same as in the first embodiment until it is immersed in the resin tank 9, and the subsequent processes will be described.

After immersing for a predetermined time, the element 1 is pulled up together with the mold from the resin, and as shown in FIG. 10, if ultraviolet rays are irradiated from outside the mold 3 by an ultraviolet lamp 14, the resin 4 is irradiated through the transparent mold. To cure. After curing, the mold 3 may be opened and the resin-cured film capacitor C may be taken out from the inside.

Example 3 In the above examples, either the thermosetting resin or the ultraviolet curable resin was used alone as the resin to be used, but in the present example, a resin that shares both properties, such as epoxy acrylate, is used. The case of using will be described.
Also in this case, the element 1 to be applied is the same as that used in each of the above-mentioned embodiments, and the mold 3 is made of glass or transparent heat-resistant resin capable of transmitting ultraviolet rays. In this case, as described above, the inner surface of the mold is preferably coated with a release agent or treated with Teflon. The manufacturing process is the same as in each of the above-described examples until it is immersed in the resin tank 9, and the subsequent processes will be described.

After the element 1 immersed in the resin is pulled up by the mold 3 and the like, the resin is cured. In this case, heating and irradiation of ultraviolet rays are performed simultaneously, or each is performed for an arbitrarily set time. For example, a method of first irradiating with ultraviolet rays, and after heating for a certain time, and then heating may be used. The heating time and the irradiation time may be appropriately selected depending on the viscosity of the resin used, the size of the element 1, and the like.

Embodiment 4 In each of the above-described embodiments, the description has been made of the case where the lead-lead-type element is used to obtain a film capacitor of the lead-lead insertion type even if a finished product is used as it is. As shown in the figure, it is bent and the tip side thereof is flattened and stored in the mold 3. At this time, the element 1
May be bonded with a double-sided tape or the like so as not to be displaced in the mold 3, and the lead wire 2 may be deformed into a shape that can be fixed in the mold 3. After accommodating the elements, by performing the same steps as those in the above-mentioned respective embodiments, a film capacitor D of a chip type having excellent dimensional accuracy and suitable for surface mounting at high density is completed as shown in FIG.

Note that the element itself may be of a chip type having no lead wire and having only a metallikon electrode, and has the same effect as the above embodiment. Further, in each of the above-mentioned embodiments, the laminated metallized film capacitor has been described, but the present invention is not limited to the above-mentioned embodiment, and the same applies to a wound metallized film capacitor or a box-shaped film capacitor and other electronic parts. It can be applied, and various design changes can be made within the scope of the technical idea described in the claims.

<Effects of the Invention> As described above, according to the method for manufacturing an electronic component of the present invention,
Unlike the conventional method of holding and storing an element that has been resin-impregnated and cured in a case, etc., and then injecting and curing the resin again, it is possible to impregnate the element with a mold and the exterior in one step, that is, the element Since the whole mold containing is dipped in the resin, many can be manufactured collectively, and the starting efficiency is greatly increased compared to the conventional method of pouring one by one, and the finished product is finally removed from the mold, In addition to mass productivity and accuracy of external dimensions, it is possible to downsize because no case is used.
It is effective for obtaining inexpensive and excellent electronic components.

[Brief description of drawings]

FIG. 1 is a block diagram showing the basic steps of the present invention, FIG. 2 is a perspective view showing a film capacitor element used in the embodiment of the present invention, and FIG. 3 is one of the molds used in the first embodiment. FIG. 4 is a cross-sectional view showing a state in which the element is mounted on a jig and housed in a die, and FIG. 5 is a cross-sectional view showing a state in which the element is immersed in the resin together with the die, FIG. Is a cross-sectional view showing the same heating state, FIG. 7 is a side view showing a state of being removed from the mold, FIG. 8 is a perspective view showing the same finished product, and FIG. 9 is used in the second and third embodiments. FIG. 10 is a perspective view showing a part of the mold.
The figure is a cross-sectional view showing a state in which the same ultraviolet irradiation is performed,
FIG. 1 is a sectional view showing a state in which elements are housed in a mold of a fourth embodiment, FIG. 12 is a perspective view showing a finished product of the chip type capacitor, and FIG. 13 is a block diagram showing a conventional manufacturing process. Is. In the figure, 1 is an element, 2 is a lead wire, 3 is a mold, 4 is resin, 5 is a metallikon layer, 6 is a partition wall, 7 is a support rod, 8 is a jig, 9 is a resin tank, 10 is an adhesive tape, 11 Is the element body,
12 is a compartment, 13 is a heater, 14 is an ultraviolet lamp, C,
D is a film capacitor.

Claims (1)

[Claims] 1. An electronic part element is housed in a mold having a structure made of a material having a high releasability and containing one or more electronic part elements, which are thermosetting or ultraviolet curable in air or a reduced pressure atmosphere, Alternatively, the mold is dipped in a resin that shares thermosetting and UV curability, the resin is filled in the mold and the element is impregnated at the same time, and then the mold is pulled up from the resin and either heating or UV irradiation is performed. A method for manufacturing an electronic component, comprising obtaining one of the electronic components by removing one of the packaged elements from the mold after curing one of them alone or both of them for a predetermined period of time for curing.