JPS55163858A - Device for positioning pellet - Google Patents

Device for positioning pellet

Info

Publication number
JPS55163858A
JPS55163858A JP6897780A JP6897780A JPS55163858A JP S55163858 A JPS55163858 A JP S55163858A JP 6897780 A JP6897780 A JP 6897780A JP 6897780 A JP6897780 A JP 6897780A JP S55163858 A JPS55163858 A JP S55163858A
Authority
JP
Japan
Prior art keywords
members
pellet
moved
positioning
jaws
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6897780A
Other languages
English (en)
Inventor
Morio Toyooka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6897780A priority Critical patent/JPS55163858A/ja
Publication of JPS55163858A publication Critical patent/JPS55163858A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automatic Assembly (AREA)
JP6897780A 1980-05-26 1980-05-26 Device for positioning pellet Pending JPS55163858A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6897780A JPS55163858A (en) 1980-05-26 1980-05-26 Device for positioning pellet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6897780A JPS55163858A (en) 1980-05-26 1980-05-26 Device for positioning pellet

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP5164972A Division JPS4911073A (ja) 1972-05-26 1972-05-26

Publications (1)

Publication Number Publication Date
JPS55163858A true JPS55163858A (en) 1980-12-20

Family

ID=13389231

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6897780A Pending JPS55163858A (en) 1980-05-26 1980-05-26 Device for positioning pellet

Country Status (1)

Country Link
JP (1) JPS55163858A (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5818342U (ja) * 1981-07-25 1983-02-04 日本電気株式会社 半導体ペレツト位置決め装置
JPS6015998A (ja) * 1983-07-08 1985-01-26 株式会社日立製作所 位置決め方法
JPS6239924U (ja) * 1985-08-27 1987-03-10
US6847099B1 (en) 2003-02-05 2005-01-25 Amkor Technology Inc. Offset etched corner leads for semiconductor package

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5818342U (ja) * 1981-07-25 1983-02-04 日本電気株式会社 半導体ペレツト位置決め装置
JPS6334270Y2 (ja) * 1981-07-25 1988-09-12
JPS6015998A (ja) * 1983-07-08 1985-01-26 株式会社日立製作所 位置決め方法
JPS6239924U (ja) * 1985-08-27 1987-03-10
JPH0333393Y2 (ja) * 1985-08-27 1991-07-16
US6847099B1 (en) 2003-02-05 2005-01-25 Amkor Technology Inc. Offset etched corner leads for semiconductor package

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