JPS55160043A - Polyethylene resin composition for film - Google Patents

Polyethylene resin composition for film

Info

Publication number
JPS55160043A
JPS55160043A JP6727079A JP6727079A JPS55160043A JP S55160043 A JPS55160043 A JP S55160043A JP 6727079 A JP6727079 A JP 6727079A JP 6727079 A JP6727079 A JP 6727079A JP S55160043 A JPS55160043 A JP S55160043A
Authority
JP
Japan
Prior art keywords
particle diameter
polyethylene resin
average particle
resin composition
silica
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6727079A
Other languages
Japanese (ja)
Other versions
JPS6144094B2 (en
Inventor
Nobunari Sugimoto
Yoshio Matsumoto
Toshio Fujii
Koji Sumino
Izumi Hosoda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Kasei Corp
Original Assignee
Mitsubishi Kasei Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Kasei Corp filed Critical Mitsubishi Kasei Corp
Priority to JP6727079A priority Critical patent/JPS55160043A/en
Publication of JPS55160043A publication Critical patent/JPS55160043A/en
Publication of JPS6144094B2 publication Critical patent/JPS6144094B2/ja
Granted legal-status Critical Current

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  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)

Abstract

PURPOSE: Title composition which provides bags free from blocking and slippage when stacked, prepared by adding to a polyethylene resin, two silica powders having specific average particle diameters.
CONSTITUTION: The resin composition comprises (A) a polyethylene resin and (B) a mixture of silica powders containing (a) 90W60wt% of silica powder having an average particle diameter of 1W10μ, and a max. particle diameter of 40μ, and (b) 10W40wt% of silica powder having an average particle diameter of 15W30μ and a max. particle diameter of 60μ. As (a), a low-density (below 0.935) polyethylene or an ethylene/vinyl acetate copolymer containing at least 6wt% of vinyl acetate and particularly, those having a melt index of 0.1W2 are preferred. The total amount of the silica powders (a) and (b) is preferably 0.01W2wt%, based on (A).
COPYRIGHT: (C)1980,JPO&Japio
JP6727079A 1979-05-30 1979-05-30 Polyethylene resin composition for film Granted JPS55160043A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6727079A JPS55160043A (en) 1979-05-30 1979-05-30 Polyethylene resin composition for film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6727079A JPS55160043A (en) 1979-05-30 1979-05-30 Polyethylene resin composition for film

Publications (2)

Publication Number Publication Date
JPS55160043A true JPS55160043A (en) 1980-12-12
JPS6144094B2 JPS6144094B2 (en) 1986-10-01

Family

ID=13340094

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6727079A Granted JPS55160043A (en) 1979-05-30 1979-05-30 Polyethylene resin composition for film

Country Status (1)

Country Link
JP (1) JPS55160043A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4772644A (en) * 1982-01-25 1988-09-20 Shin-Etsu Chemical Co., Ltd. Method for resin encapsulation of a semiconductor device and a resin composition therefor
EP0707039A1 (en) * 1994-09-22 1996-04-17 Sumitomo Chemical Company, Limited Polyolefin resin composition

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4772644A (en) * 1982-01-25 1988-09-20 Shin-Etsu Chemical Co., Ltd. Method for resin encapsulation of a semiconductor device and a resin composition therefor
EP0707039A1 (en) * 1994-09-22 1996-04-17 Sumitomo Chemical Company, Limited Polyolefin resin composition

Also Published As

Publication number Publication date
JPS6144094B2 (en) 1986-10-01

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