JPS55158485U - - Google Patents

Info

Publication number
JPS55158485U
JPS55158485U JP5677679U JP5677679U JPS55158485U JP S55158485 U JPS55158485 U JP S55158485U JP 5677679 U JP5677679 U JP 5677679U JP 5677679 U JP5677679 U JP 5677679U JP S55158485 U JPS55158485 U JP S55158485U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5677679U
Other languages
Japanese (ja)
Other versions
JPS5654458Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5677679U priority Critical patent/JPS5654458Y2/ja
Publication of JPS55158485U publication Critical patent/JPS55158485U/ja
Application granted granted Critical
Publication of JPS5654458Y2 publication Critical patent/JPS5654458Y2/ja
Expired legal-status Critical Current

Links

JP5677679U 1979-04-27 1979-04-27 Expired JPS5654458Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5677679U JPS5654458Y2 (en) 1979-04-27 1979-04-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5677679U JPS5654458Y2 (en) 1979-04-27 1979-04-27

Publications (2)

Publication Number Publication Date
JPS55158485U true JPS55158485U (en) 1980-11-14
JPS5654458Y2 JPS5654458Y2 (en) 1981-12-18

Family

ID=29290880

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5677679U Expired JPS5654458Y2 (en) 1979-04-27 1979-04-27

Country Status (1)

Country Link
JP (1) JPS5654458Y2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5838694A (en) * 1981-08-31 1983-03-07 Toshiba Corp Solder for semiconductor die bonding
JPWO2015041216A1 (en) * 2013-09-20 2017-03-02 三菱電機株式会社 Heat exchanger, air conditioner using the heat exchanger, and method for manufacturing the heat exchanger
WO2019004139A1 (en) * 2017-06-30 2019-01-03 ダイキン工業株式会社 Heat exchanger

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5838694A (en) * 1981-08-31 1983-03-07 Toshiba Corp Solder for semiconductor die bonding
JPWO2015041216A1 (en) * 2013-09-20 2017-03-02 三菱電機株式会社 Heat exchanger, air conditioner using the heat exchanger, and method for manufacturing the heat exchanger
WO2019004139A1 (en) * 2017-06-30 2019-01-03 ダイキン工業株式会社 Heat exchanger
JP2019011923A (en) * 2017-06-30 2019-01-24 ダイキン工業株式会社 Heat exchanger

Also Published As

Publication number Publication date
JPS5654458Y2 (en) 1981-12-18

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