JPS55149976U - - Google Patents
Info
- Publication number
- JPS55149976U JPS55149976U JP1979048352U JP4835279U JPS55149976U JP S55149976 U JPS55149976 U JP S55149976U JP 1979048352 U JP1979048352 U JP 1979048352U JP 4835279 U JP4835279 U JP 4835279U JP S55149976 U JPS55149976 U JP S55149976U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1979048352U JPS5943753Y2 (ja) | 1979-04-13 | 1979-04-13 | 電子回路の基板構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1979048352U JPS5943753Y2 (ja) | 1979-04-13 | 1979-04-13 | 電子回路の基板構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55149976U true JPS55149976U (enrdf_load_stackoverflow) | 1980-10-29 |
| JPS5943753Y2 JPS5943753Y2 (ja) | 1984-12-26 |
Family
ID=28931909
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1979048352U Expired JPS5943753Y2 (ja) | 1979-04-13 | 1979-04-13 | 電子回路の基板構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5943753Y2 (enrdf_load_stackoverflow) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49126151U (enrdf_load_stackoverflow) * | 1973-02-27 | 1974-10-29 |
-
1979
- 1979-04-13 JP JP1979048352U patent/JPS5943753Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49126151U (enrdf_load_stackoverflow) * | 1973-02-27 | 1974-10-29 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5943753Y2 (ja) | 1984-12-26 |