JPS5514792U - - Google Patents

Info

Publication number
JPS5514792U
JPS5514792U JP1978098712U JP9871278U JPS5514792U JP S5514792 U JPS5514792 U JP S5514792U JP 1978098712 U JP1978098712 U JP 1978098712U JP 9871278 U JP9871278 U JP 9871278U JP S5514792 U JPS5514792 U JP S5514792U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1978098712U
Other versions
JPS5847709Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1978098712U priority Critical patent/JPS5847709Y2/ja
Publication of JPS5514792U publication Critical patent/JPS5514792U/ja
Application granted granted Critical
Publication of JPS5847709Y2 publication Critical patent/JPS5847709Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
JP1978098712U 1978-07-18 1978-07-18 樹脂封止形半導体素子 Expired JPS5847709Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1978098712U JPS5847709Y2 (ja) 1978-07-18 1978-07-18 樹脂封止形半導体素子

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1978098712U JPS5847709Y2 (ja) 1978-07-18 1978-07-18 樹脂封止形半導体素子

Publications (2)

Publication Number Publication Date
JPS5514792U true JPS5514792U (ja) 1980-01-30
JPS5847709Y2 JPS5847709Y2 (ja) 1983-10-31

Family

ID=29034737

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1978098712U Expired JPS5847709Y2 (ja) 1978-07-18 1978-07-18 樹脂封止形半導体素子

Country Status (1)

Country Link
JP (1) JPS5847709Y2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6045900U (ja) * 1983-09-06 1985-03-30 松下精工株式会社 送風機の消音装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6045900U (ja) * 1983-09-06 1985-03-30 松下精工株式会社 送風機の消音装置

Also Published As

Publication number Publication date
JPS5847709Y2 (ja) 1983-10-31

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