JPS55139556U - - Google Patents

Info

Publication number
JPS55139556U
JPS55139556U JP3977579U JP3977579U JPS55139556U JP S55139556 U JPS55139556 U JP S55139556U JP 3977579 U JP3977579 U JP 3977579U JP 3977579 U JP3977579 U JP 3977579U JP S55139556 U JPS55139556 U JP S55139556U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3977579U
Other languages
Japanese (ja)
Other versions
JPS6018845Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3977579U priority Critical patent/JPS6018845Y2/ja
Publication of JPS55139556U publication Critical patent/JPS55139556U/ja
Application granted granted Critical
Publication of JPS6018845Y2 publication Critical patent/JPS6018845Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015Shape
    • H01L2924/10155Shape being other than a cuboid

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP3977579U 1979-03-26 1979-03-26 Dhdガラス封止ダイオ−ド Expired JPS6018845Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3977579U JPS6018845Y2 (ja) 1979-03-26 1979-03-26 Dhdガラス封止ダイオ−ド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3977579U JPS6018845Y2 (ja) 1979-03-26 1979-03-26 Dhdガラス封止ダイオ−ド

Publications (2)

Publication Number Publication Date
JPS55139556U true JPS55139556U (enrdf_load_stackoverflow) 1980-10-04
JPS6018845Y2 JPS6018845Y2 (ja) 1985-06-07

Family

ID=28907228

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3977579U Expired JPS6018845Y2 (ja) 1979-03-26 1979-03-26 Dhdガラス封止ダイオ−ド

Country Status (1)

Country Link
JP (1) JPS6018845Y2 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57135743U (enrdf_load_stackoverflow) * 1981-02-20 1982-08-24

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57135743U (enrdf_load_stackoverflow) * 1981-02-20 1982-08-24

Also Published As

Publication number Publication date
JPS6018845Y2 (ja) 1985-06-07

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