JPS5513741A - Molding resin composition - Google Patents

Molding resin composition

Info

Publication number
JPS5513741A
JPS5513741A JP8675678A JP8675678A JPS5513741A JP S5513741 A JPS5513741 A JP S5513741A JP 8675678 A JP8675678 A JP 8675678A JP 8675678 A JP8675678 A JP 8675678A JP S5513741 A JPS5513741 A JP S5513741A
Authority
JP
Japan
Prior art keywords
resin
particle size
give
resin composition
weight ratio
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8675678A
Other languages
Japanese (ja)
Inventor
Atsuo Kokubo
Nanao Nakamura
Haruaki Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP8675678A priority Critical patent/JPS5513741A/en
Publication of JPS5513741A publication Critical patent/JPS5513741A/en
Pending legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Macromonomer-Based Addition Polymer (AREA)

Abstract

PURPOSE: The title composition having improved fluidity, moldability, and mechanical strength, with little shrinkage or expansion in molding and curing, comprising a resin consisting of polystyrene containing styrene monomer and an unsaturated polyester resin and inorganic powder of specific particle size.
CONSTITUTION: (a) Polystyrene containing 30W60 wt.% of styrene is incorporated with (b) an unsaturated polyester resin obtained by condensing propylene glycol and maleic acid at a weight ratio of (b) to (a) of 1:0.2W0.4 to give a resin (A). The resin (A) is mixed with (B) inorganic powder, e.g. ceramic powder, kaolin clay, talc, or glass powder wherein 10W300 wt.% has a particle size ≥100μ, and 50W70 wt.% has a particle size ≤50μ, to give the desired molding resin composition. The weight ratio of (B) to (A) is preferably 1:0.2W0.35.
COPYRIGHT: (C)1980,JPO&Japio
JP8675678A 1978-07-18 1978-07-18 Molding resin composition Pending JPS5513741A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8675678A JPS5513741A (en) 1978-07-18 1978-07-18 Molding resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8675678A JPS5513741A (en) 1978-07-18 1978-07-18 Molding resin composition

Publications (1)

Publication Number Publication Date
JPS5513741A true JPS5513741A (en) 1980-01-30

Family

ID=13895592

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8675678A Pending JPS5513741A (en) 1978-07-18 1978-07-18 Molding resin composition

Country Status (1)

Country Link
JP (1) JPS5513741A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58127718A (en) * 1982-01-27 1983-07-29 Toshiba Corp Unsaturated polyester resin composition and colored molding

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58127718A (en) * 1982-01-27 1983-07-29 Toshiba Corp Unsaturated polyester resin composition and colored molding

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