JPS55124965A - Preliminary solder of lead wire with evaporated thin film - Google Patents

Preliminary solder of lead wire with evaporated thin film

Info

Publication number
JPS55124965A
JPS55124965A JP3151679A JP3151679A JPS55124965A JP S55124965 A JPS55124965 A JP S55124965A JP 3151679 A JP3151679 A JP 3151679A JP 3151679 A JP3151679 A JP 3151679A JP S55124965 A JPS55124965 A JP S55124965A
Authority
JP
Japan
Prior art keywords
thin film
lead wire
preliminary solder
evaporated thin
evaporated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3151679A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6138588B2 (enrdf_load_stackoverflow
Inventor
Masanori Konuma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pioneer Corp
Original Assignee
Pioneer Electronic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pioneer Electronic Corp filed Critical Pioneer Electronic Corp
Priority to JP3151679A priority Critical patent/JPS55124965A/ja
Publication of JPS55124965A publication Critical patent/JPS55124965A/ja
Publication of JPS6138588B2 publication Critical patent/JPS6138588B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Electrical Connectors (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Details Of Resistors (AREA)
  • Non-Adjustable Resistors (AREA)
JP3151679A 1979-03-17 1979-03-17 Preliminary solder of lead wire with evaporated thin film Granted JPS55124965A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3151679A JPS55124965A (en) 1979-03-17 1979-03-17 Preliminary solder of lead wire with evaporated thin film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3151679A JPS55124965A (en) 1979-03-17 1979-03-17 Preliminary solder of lead wire with evaporated thin film

Publications (2)

Publication Number Publication Date
JPS55124965A true JPS55124965A (en) 1980-09-26
JPS6138588B2 JPS6138588B2 (enrdf_load_stackoverflow) 1986-08-29

Family

ID=12333359

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3151679A Granted JPS55124965A (en) 1979-03-17 1979-03-17 Preliminary solder of lead wire with evaporated thin film

Country Status (1)

Country Link
JP (1) JPS55124965A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6294358A (ja) * 1985-10-22 1987-04-30 Hitachi Ltd ダイレクトドライブ型サーマルヘッドの製造方法
JPH0260101A (ja) * 1988-08-26 1990-02-28 Alps Electric Co Ltd チップ電子部品
US5038996A (en) * 1988-10-12 1991-08-13 International Business Machines Corporation Bonding of metallic surfaces

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6294358A (ja) * 1985-10-22 1987-04-30 Hitachi Ltd ダイレクトドライブ型サーマルヘッドの製造方法
JPH0260101A (ja) * 1988-08-26 1990-02-28 Alps Electric Co Ltd チップ電子部品
US5038996A (en) * 1988-10-12 1991-08-13 International Business Machines Corporation Bonding of metallic surfaces

Also Published As

Publication number Publication date
JPS6138588B2 (enrdf_load_stackoverflow) 1986-08-29

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