JPS55124850U - - Google Patents
Info
- Publication number
- JPS55124850U JPS55124850U JP2346579U JP2346579U JPS55124850U JP S55124850 U JPS55124850 U JP S55124850U JP 2346579 U JP2346579 U JP 2346579U JP 2346579 U JP2346579 U JP 2346579U JP S55124850 U JPS55124850 U JP S55124850U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2346579U JPS5832264Y2 (ja) | 1979-02-23 | 1979-02-23 | リ−ドフレ−ム保持具 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2346579U JPS5832264Y2 (ja) | 1979-02-23 | 1979-02-23 | リ−ドフレ−ム保持具 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55124850U true JPS55124850U (ja) | 1980-09-04 |
| JPS5832264Y2 JPS5832264Y2 (ja) | 1983-07-18 |
Family
ID=28860127
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2346579U Expired JPS5832264Y2 (ja) | 1979-02-23 | 1979-02-23 | リ−ドフレ−ム保持具 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5832264Y2 (ja) |
-
1979
- 1979-02-23 JP JP2346579U patent/JPS5832264Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5832264Y2 (ja) | 1983-07-18 |