JPS551145A - Semiconductor wafer photo-resist applicator - Google Patents

Semiconductor wafer photo-resist applicator

Info

Publication number
JPS551145A
JPS551145A JP7439678A JP7439678A JPS551145A JP S551145 A JPS551145 A JP S551145A JP 7439678 A JP7439678 A JP 7439678A JP 7439678 A JP7439678 A JP 7439678A JP S551145 A JPS551145 A JP S551145A
Authority
JP
Japan
Prior art keywords
resist
wafer
pipe
photo
valve
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7439678A
Other languages
Japanese (ja)
Inventor
Minoru Okamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP7439678A priority Critical patent/JPS551145A/en
Publication of JPS551145A publication Critical patent/JPS551145A/en
Pending legal-status Critical Current

Links

Landscapes

  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE:To automatically uniform resist film in thickness by providing in this semiconductor wafer photo-resist applicator a mechanism for dripping photo-resist on a wafer at a constant rate. CONSTITUTION:An air suction operating valve 16, a stainless or teflon corrugated flexible pipe 11 sealed by flat plates 12 at the both end, and an air supply operating valve 14 are arranged between a photo-resist 1 storage container 17 and the nozzle 8 placed on a wafer 9. A closed circuit for resist supply is thus constructed, said pipe 11 is compressed by using a cylinder 18, and at the same time a valve 14 is opened for expelling the resist 1 filled in said pipe 11. Thus, said resist 1 is dripped on said wafer 9 through a nozzle 8. Thereafter, gas 20 is placed in said cylinder 18, said pipe 11 is extended, at the same time said valve 16 is opened, and resist 1 is supplied in said pipe 11. By repeating the operation described heretofore, resist 1 is applied on said wafer 9 uniformly in thickness.
JP7439678A 1978-06-19 1978-06-19 Semiconductor wafer photo-resist applicator Pending JPS551145A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7439678A JPS551145A (en) 1978-06-19 1978-06-19 Semiconductor wafer photo-resist applicator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7439678A JPS551145A (en) 1978-06-19 1978-06-19 Semiconductor wafer photo-resist applicator

Publications (1)

Publication Number Publication Date
JPS551145A true JPS551145A (en) 1980-01-07

Family

ID=13545975

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7439678A Pending JPS551145A (en) 1978-06-19 1978-06-19 Semiconductor wafer photo-resist applicator

Country Status (1)

Country Link
JP (1) JPS551145A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62183885A (en) * 1986-12-19 1987-08-12 Toshiba Corp Rotary coating method
JPH02131237A (en) * 1988-11-11 1990-05-21 Tokyo Electron Ltd Resist processor

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62183885A (en) * 1986-12-19 1987-08-12 Toshiba Corp Rotary coating method
JPH0426912B2 (en) * 1986-12-19 1992-05-08 Tokyo Shibaura Electric Co
JPH02131237A (en) * 1988-11-11 1990-05-21 Tokyo Electron Ltd Resist processor

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