JPS551120A - Driver for wafer holder - Google Patents

Driver for wafer holder

Info

Publication number
JPS551120A
JPS551120A JP7353678A JP7353678A JPS551120A JP S551120 A JPS551120 A JP S551120A JP 7353678 A JP7353678 A JP 7353678A JP 7353678 A JP7353678 A JP 7353678A JP S551120 A JPS551120 A JP S551120A
Authority
JP
Japan
Prior art keywords
holder
holding side
plate
groove
parallel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7353678A
Other languages
Japanese (ja)
Other versions
JPS593823B2 (en
Inventor
Tsuneo Hiramatsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissin Electric Co Ltd
Original Assignee
Nissin Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissin Electric Co Ltd filed Critical Nissin Electric Co Ltd
Priority to JP7353678A priority Critical patent/JPS593823B2/en
Publication of JPS551120A publication Critical patent/JPS551120A/en
Publication of JPS593823B2 publication Critical patent/JPS593823B2/en
Expired legal-status Critical Current

Links

Abstract

PURPOSE: To eliminate the limitation on the decending distance of a wafer holder and prevent the application of inappropriate force to the holder, by applying a driving force to the holder in the direction of a holding side of a driver.
CONSTITUTION: When a connection shaft 32 is driven rightward, rollers 46, 48 are guided in grooves 37, 38 and a plate 40 is moved. At that time, rollers 47, 49 are guided in a groove 39 through links 42, 43 and a plate 41 is translated in the direction of the groove 39. Because the groove 39 is parallel with the holding side, a heat plate 15 and guide shafts 14A, 14B are pushed down in parallel with the holding side by a metal member 51. Therefore, no inappropriate force is applied to the guide shafts 14A, 14B and the push-down distance is not limited. When the connection shaft 32 is driven leftward, the metal member 51 is moved up and the head plate 15 is returned to the original position by a spring 16. The driving force for holding a wafer can thus be applied to the wafer holder in parallel with the holding side.
COPYRIGHT: (C)1980,JPO&Japio
JP7353678A 1978-06-16 1978-06-16 Drive device for wafer holding device Expired JPS593823B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7353678A JPS593823B2 (en) 1978-06-16 1978-06-16 Drive device for wafer holding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7353678A JPS593823B2 (en) 1978-06-16 1978-06-16 Drive device for wafer holding device

Publications (2)

Publication Number Publication Date
JPS551120A true JPS551120A (en) 1980-01-07
JPS593823B2 JPS593823B2 (en) 1984-01-26

Family

ID=13521040

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7353678A Expired JPS593823B2 (en) 1978-06-16 1978-06-16 Drive device for wafer holding device

Country Status (1)

Country Link
JP (1) JPS593823B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58120653U (en) * 1982-02-10 1983-08-17 日本真空技術株式会社 wafer grip equipment
JPS58164237U (en) * 1982-04-27 1983-11-01 日本真空技術株式会社 wafer grip equipment

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61150783U (en) * 1985-03-12 1986-09-18

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58120653U (en) * 1982-02-10 1983-08-17 日本真空技術株式会社 wafer grip equipment
JPS58164237U (en) * 1982-04-27 1983-11-01 日本真空技術株式会社 wafer grip equipment

Also Published As

Publication number Publication date
JPS593823B2 (en) 1984-01-26

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