JPS55111195A - Method of fabricating flexible circuit board - Google Patents

Method of fabricating flexible circuit board

Info

Publication number
JPS55111195A
JPS55111195A JP1847679A JP1847679A JPS55111195A JP S55111195 A JPS55111195 A JP S55111195A JP 1847679 A JP1847679 A JP 1847679A JP 1847679 A JP1847679 A JP 1847679A JP S55111195 A JPS55111195 A JP S55111195A
Authority
JP
Japan
Prior art keywords
circuit board
flexible circuit
fabricating flexible
fabricating
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1847679A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6239557B2 (enrdf_load_stackoverflow
Inventor
Hiroaki Okudaira
Toshio Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1847679A priority Critical patent/JPS55111195A/ja
Publication of JPS55111195A publication Critical patent/JPS55111195A/ja
Publication of JPS6239557B2 publication Critical patent/JPS6239557B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)
JP1847679A 1979-02-21 1979-02-21 Method of fabricating flexible circuit board Granted JPS55111195A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1847679A JPS55111195A (en) 1979-02-21 1979-02-21 Method of fabricating flexible circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1847679A JPS55111195A (en) 1979-02-21 1979-02-21 Method of fabricating flexible circuit board

Publications (2)

Publication Number Publication Date
JPS55111195A true JPS55111195A (en) 1980-08-27
JPS6239557B2 JPS6239557B2 (enrdf_load_stackoverflow) 1987-08-24

Family

ID=11972686

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1847679A Granted JPS55111195A (en) 1979-02-21 1979-02-21 Method of fabricating flexible circuit board

Country Status (1)

Country Link
JP (1) JPS55111195A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0438757U (enrdf_load_stackoverflow) * 1990-07-31 1992-04-02

Also Published As

Publication number Publication date
JPS6239557B2 (enrdf_load_stackoverflow) 1987-08-24

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