JPS55110174A - Bonding method - Google Patents
Bonding methodInfo
- Publication number
- JPS55110174A JPS55110174A JP1868779A JP1868779A JPS55110174A JP S55110174 A JPS55110174 A JP S55110174A JP 1868779 A JP1868779 A JP 1868779A JP 1868779 A JP1868779 A JP 1868779A JP S55110174 A JPS55110174 A JP S55110174A
- Authority
- JP
- Japan
- Prior art keywords
- liquid
- drop
- adhesive
- bonding
- cold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To carry out the bonding and sealing of a part with a two-pack type, cold-setting, modified acrylate solventless adhesive consisting of the first liquid containing a curing agent and the second liquid containing a curing accelerator, by applying the adhesive in the form of a spot under specific conditions.
CONSTITUTION: A method for bonding with a two-pack solventless, cold-setting modified acrylate adhesive consisting of the first liquid [(A) liquid] consisting of methyl methacrylate and an organic peroxide as a curing agent and the second liquid [(B) liquid] consisting of methyl methacrylate and a curing accelerator which accelerates the decomposition of the organic peroxide and facilitates the generation of free radicals (e.g. dimethyl p-toluidine). The (A) liquid is applied to the part to be bonded in the form of a drop, and then the (B) liquid is applied thereto to cover the whole surface of the drop of the (A) liquid. The composite drop thus obtained is cured as it is.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1868779A JPS55110174A (en) | 1979-02-20 | 1979-02-20 | Bonding method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1868779A JPS55110174A (en) | 1979-02-20 | 1979-02-20 | Bonding method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55110174A true JPS55110174A (en) | 1980-08-25 |
Family
ID=11978514
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1868779A Pending JPS55110174A (en) | 1979-02-20 | 1979-02-20 | Bonding method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55110174A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5890898A (en) * | 1981-11-26 | 1983-05-30 | Pioneer Electronic Corp | Speaker |
WO2014139932A1 (en) | 2013-03-11 | 2014-09-18 | Vita Zahnfabrik H.Rauter Gmbh & Co. Kg | Two-component adhesive for bonding artificial teeth to a denture base |
-
1979
- 1979-02-20 JP JP1868779A patent/JPS55110174A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5890898A (en) * | 1981-11-26 | 1983-05-30 | Pioneer Electronic Corp | Speaker |
WO2014139932A1 (en) | 2013-03-11 | 2014-09-18 | Vita Zahnfabrik H.Rauter Gmbh & Co. Kg | Two-component adhesive for bonding artificial teeth to a denture base |
US9918908B2 (en) | 2013-03-11 | 2018-03-20 | Vita Zahnfabrik H. Rauter Gmbh & Co. Kg | Two-component adhesive for bonding artificial teeth to a denture base |
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