JPS55108426A - Thermosetting resin molding material - Google Patents
Thermosetting resin molding materialInfo
- Publication number
- JPS55108426A JPS55108426A JP1651379A JP1651379A JPS55108426A JP S55108426 A JPS55108426 A JP S55108426A JP 1651379 A JP1651379 A JP 1651379A JP 1651379 A JP1651379 A JP 1651379A JP S55108426 A JPS55108426 A JP S55108426A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- molding material
- mixing
- thermosetting resin
- prepared
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
PURPOSE: Title resin molding material which is almost free of dimensional change at high temperatures and mold shrinkage, and which is useful as a material for making large electrical parts, prepared by mixing a resin and a specific amount of flat mica having an aspect ratio in a specific range.
CONSTITUTION: The molding material is prepared by mixing (a) 100pts.wt. of a thermosetting resin such as phenol resin, unsaturated polyester resin, diallyl phthalate resin, or epoxy resin, and (b) 100W300pts.wt. of flat mica having an aspect ratio (diameter/thickness) of 50W200, in amounts to provide a weight ratio of components (a) to (b) of 1/1W1/100, or preferably, by further mixing the resulting mixture and (c) a flexible fibrous filler, such as asbestos, linter, or Tetron.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1651379A JPS55108426A (en) | 1979-02-14 | 1979-02-14 | Thermosetting resin molding material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1651379A JPS55108426A (en) | 1979-02-14 | 1979-02-14 | Thermosetting resin molding material |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55108426A true JPS55108426A (en) | 1980-08-20 |
Family
ID=11918344
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1651379A Pending JPS55108426A (en) | 1979-02-14 | 1979-02-14 | Thermosetting resin molding material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55108426A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59102936A (en) * | 1982-12-03 | 1984-06-14 | Kuraray Co Ltd | Composite polymer material for ultra-low temperature use |
-
1979
- 1979-02-14 JP JP1651379A patent/JPS55108426A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59102936A (en) * | 1982-12-03 | 1984-06-14 | Kuraray Co Ltd | Composite polymer material for ultra-low temperature use |
JPH0361693B2 (en) * | 1982-12-03 | 1991-09-20 | Kuraray Co |
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