JPS55108426A - Thermosetting resin molding material - Google Patents

Thermosetting resin molding material

Info

Publication number
JPS55108426A
JPS55108426A JP1651379A JP1651379A JPS55108426A JP S55108426 A JPS55108426 A JP S55108426A JP 1651379 A JP1651379 A JP 1651379A JP 1651379 A JP1651379 A JP 1651379A JP S55108426 A JPS55108426 A JP S55108426A
Authority
JP
Japan
Prior art keywords
resin
molding material
mixing
thermosetting resin
prepared
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1651379A
Other languages
Japanese (ja)
Inventor
Takaaki Sakamoto
Yoshihiro Kitsuta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP1651379A priority Critical patent/JPS55108426A/en
Publication of JPS55108426A publication Critical patent/JPS55108426A/en
Pending legal-status Critical Current

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Abstract

PURPOSE: Title resin molding material which is almost free of dimensional change at high temperatures and mold shrinkage, and which is useful as a material for making large electrical parts, prepared by mixing a resin and a specific amount of flat mica having an aspect ratio in a specific range.
CONSTITUTION: The molding material is prepared by mixing (a) 100pts.wt. of a thermosetting resin such as phenol resin, unsaturated polyester resin, diallyl phthalate resin, or epoxy resin, and (b) 100W300pts.wt. of flat mica having an aspect ratio (diameter/thickness) of 50W200, in amounts to provide a weight ratio of components (a) to (b) of 1/1W1/100, or preferably, by further mixing the resulting mixture and (c) a flexible fibrous filler, such as asbestos, linter, or Tetron.
COPYRIGHT: (C)1980,JPO&Japio
JP1651379A 1979-02-14 1979-02-14 Thermosetting resin molding material Pending JPS55108426A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1651379A JPS55108426A (en) 1979-02-14 1979-02-14 Thermosetting resin molding material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1651379A JPS55108426A (en) 1979-02-14 1979-02-14 Thermosetting resin molding material

Publications (1)

Publication Number Publication Date
JPS55108426A true JPS55108426A (en) 1980-08-20

Family

ID=11918344

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1651379A Pending JPS55108426A (en) 1979-02-14 1979-02-14 Thermosetting resin molding material

Country Status (1)

Country Link
JP (1) JPS55108426A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59102936A (en) * 1982-12-03 1984-06-14 Kuraray Co Ltd Composite polymer material for ultra-low temperature use

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59102936A (en) * 1982-12-03 1984-06-14 Kuraray Co Ltd Composite polymer material for ultra-low temperature use
JPH0361693B2 (en) * 1982-12-03 1991-09-20 Kuraray Co

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