JPS55107778A - Metallizing apparatus - Google Patents

Metallizing apparatus

Info

Publication number
JPS55107778A
JPS55107778A JP1660379A JP1660379A JPS55107778A JP S55107778 A JPS55107778 A JP S55107778A JP 1660379 A JP1660379 A JP 1660379A JP 1660379 A JP1660379 A JP 1660379A JP S55107778 A JPS55107778 A JP S55107778A
Authority
JP
Japan
Prior art keywords
masking shield
metallizing
sputtering
film
target electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1660379A
Other languages
Japanese (ja)
Inventor
Kenzo Ochi
Osamu Yamazaki
Kiyotaka Wasa
Shigeru Hayakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP1660379A priority Critical patent/JPS55107778A/en
Publication of JPS55107778A publication Critical patent/JPS55107778A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C23C14/044—Coating on selected surface areas, e.g. using masks using masks using masks to redistribute rather than totally prevent coating, e.g. producing thickness gradient
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks

Abstract

PURPOSE:To form metallizing film with excellent reproducibility, by, in sputtering- metallizing while a masking shield and a substrate, which are arranged opposite to an evaporation source, being moved relatively, coating the surface of the masking shield with a specific material. CONSTITUTION:Substrates 3a, 3b, 3c etc. are sputtering-metallized in an argon atmosphere while a substrate support 2 being revolved around a target electrode 1 with the target electrode 1 and the masking shield 4 fixed. In that case, the surface of the masking shield 4 is applied thinly with a vacuum grease or coated with a fluorine resin etc. in order to prevent the adherence of metallizing material. Hereby, the masking shield is kept at a constant shape for a long time. Consequently, metallizing by repeated use of the masking shield will form a film at excellent reproducibility.
JP1660379A 1979-02-14 1979-02-14 Metallizing apparatus Pending JPS55107778A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1660379A JPS55107778A (en) 1979-02-14 1979-02-14 Metallizing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1660379A JPS55107778A (en) 1979-02-14 1979-02-14 Metallizing apparatus

Publications (1)

Publication Number Publication Date
JPS55107778A true JPS55107778A (en) 1980-08-19

Family

ID=11920866

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1660379A Pending JPS55107778A (en) 1979-02-14 1979-02-14 Metallizing apparatus

Country Status (1)

Country Link
JP (1) JPS55107778A (en)

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