JPS55106762A - Grinding method of glass side edge - Google Patents
Grinding method of glass side edgeInfo
- Publication number
- JPS55106762A JPS55106762A JP1258779A JP1258779A JPS55106762A JP S55106762 A JPS55106762 A JP S55106762A JP 1258779 A JP1258779 A JP 1258779A JP 1258779 A JP1258779 A JP 1258779A JP S55106762 A JPS55106762 A JP S55106762A
- Authority
- JP
- Japan
- Prior art keywords
- edge
- side edge
- grinded
- grinding
- escape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1258779A JPS55106762A (en) | 1979-02-06 | 1979-02-06 | Grinding method of glass side edge |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1258779A JPS55106762A (en) | 1979-02-06 | 1979-02-06 | Grinding method of glass side edge |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55106762A true JPS55106762A (en) | 1980-08-15 |
| JPS6119386B2 JPS6119386B2 (enrdf_load_stackoverflow) | 1986-05-16 |
Family
ID=11809479
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1258779A Granted JPS55106762A (en) | 1979-02-06 | 1979-02-06 | Grinding method of glass side edge |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55106762A (enrdf_load_stackoverflow) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5087307A (en) * | 1985-12-27 | 1992-02-11 | Kabushiki Kaisha Toshiba | Method of manufacturing semiconductor substrate |
| US5152857A (en) * | 1990-03-29 | 1992-10-06 | Shin-Etsu Handotai Co., Ltd. | Method for preparing a substrate for semiconductor devices |
| US5545277A (en) * | 1994-10-03 | 1996-08-13 | Ford Motor Company | Plate glass edge strength |
| US6200197B1 (en) * | 1992-05-06 | 2001-03-13 | Ab Strukturteknologier I Stockholm | Method for machining and forming a transcurrent opening in a fiber-reinforced composite material |
| CN108081066A (zh) * | 2017-12-14 | 2018-05-29 | 浙江理工大学 | 玻璃花边磨削方法 |
-
1979
- 1979-02-06 JP JP1258779A patent/JPS55106762A/ja active Granted
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5087307A (en) * | 1985-12-27 | 1992-02-11 | Kabushiki Kaisha Toshiba | Method of manufacturing semiconductor substrate |
| US5152857A (en) * | 1990-03-29 | 1992-10-06 | Shin-Etsu Handotai Co., Ltd. | Method for preparing a substrate for semiconductor devices |
| US6200197B1 (en) * | 1992-05-06 | 2001-03-13 | Ab Strukturteknologier I Stockholm | Method for machining and forming a transcurrent opening in a fiber-reinforced composite material |
| US5545277A (en) * | 1994-10-03 | 1996-08-13 | Ford Motor Company | Plate glass edge strength |
| US5667897A (en) * | 1994-10-03 | 1997-09-16 | Ford Motor Company | Plate glass edge strength |
| CN108081066A (zh) * | 2017-12-14 | 2018-05-29 | 浙江理工大学 | 玻璃花边磨削方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6119386B2 (enrdf_load_stackoverflow) | 1986-05-16 |
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