JPS55102295A - Method of continuously fabricating flexible copper insulated substrate - Google Patents
Method of continuously fabricating flexible copper insulated substrateInfo
- Publication number
- JPS55102295A JPS55102295A JP907479A JP907479A JPS55102295A JP S55102295 A JPS55102295 A JP S55102295A JP 907479 A JP907479 A JP 907479A JP 907479 A JP907479 A JP 907479A JP S55102295 A JPS55102295 A JP S55102295A
- Authority
- JP
- Japan
- Prior art keywords
- insulated substrate
- flexible copper
- fabricating flexible
- copper insulated
- continuously fabricating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP907479A JPS55102295A (en) | 1979-01-31 | 1979-01-31 | Method of continuously fabricating flexible copper insulated substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP907479A JPS55102295A (en) | 1979-01-31 | 1979-01-31 | Method of continuously fabricating flexible copper insulated substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55102295A true JPS55102295A (en) | 1980-08-05 |
JPS5751997B2 JPS5751997B2 (en) | 1982-11-05 |
Family
ID=11710451
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP907479A Granted JPS55102295A (en) | 1979-01-31 | 1979-01-31 | Method of continuously fabricating flexible copper insulated substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55102295A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60115439A (en) * | 1983-11-28 | 1985-06-21 | 松下電工株式会社 | Manufacture of metallic foil lined laminated board |
US7080442B2 (en) | 1997-09-03 | 2006-07-25 | Hosiden Electronics Co., Ltd. | Manufacturing method of acoustic sensor |
-
1979
- 1979-01-31 JP JP907479A patent/JPS55102295A/en active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60115439A (en) * | 1983-11-28 | 1985-06-21 | 松下電工株式会社 | Manufacture of metallic foil lined laminated board |
JPH0433620B2 (en) * | 1983-11-28 | 1992-06-03 | Matsushita Electric Works Ltd | |
US7080442B2 (en) | 1997-09-03 | 2006-07-25 | Hosiden Electronics Co., Ltd. | Manufacturing method of acoustic sensor |
US7204009B2 (en) | 1997-09-03 | 2007-04-17 | Hosiden Electronics Co., Ltd. | Manufacturing method of acoustic sensor |
Also Published As
Publication number | Publication date |
---|---|
JPS5751997B2 (en) | 1982-11-05 |
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