JPS5583286A - Method of forming conductive layer - Google Patents

Method of forming conductive layer

Info

Publication number
JPS5583286A
JPS5583286A JP15964478A JP15964478A JPS5583286A JP S5583286 A JPS5583286 A JP S5583286A JP 15964478 A JP15964478 A JP 15964478A JP 15964478 A JP15964478 A JP 15964478A JP S5583286 A JPS5583286 A JP S5583286A
Authority
JP
Japan
Prior art keywords
conductive layer
forming conductive
forming
layer
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15964478A
Other languages
Japanese (ja)
Inventor
Kenji Oosawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP15964478A priority Critical patent/JPS5583286A/en
Publication of JPS5583286A publication Critical patent/JPS5583286A/en
Pending legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
JP15964478A 1978-12-20 1978-12-20 Method of forming conductive layer Pending JPS5583286A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15964478A JPS5583286A (en) 1978-12-20 1978-12-20 Method of forming conductive layer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15964478A JPS5583286A (en) 1978-12-20 1978-12-20 Method of forming conductive layer

Publications (1)

Publication Number Publication Date
JPS5583286A true JPS5583286A (en) 1980-06-23

Family

ID=15698208

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15964478A Pending JPS5583286A (en) 1978-12-20 1978-12-20 Method of forming conductive layer

Country Status (1)

Country Link
JP (1) JPS5583286A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014078716A (en) * 2012-10-10 2014-05-01 E.I.Du Pont De Nemours And Company Lamination of polymer thick film conductor compositions
JP2016009731A (en) * 2014-06-24 2016-01-18 コニカミノルタ株式会社 Method and device for forming conductive pattern
JP2016189397A (en) * 2015-03-30 2016-11-04 三菱マテリアル株式会社 METHOD OF MANUFACTURING SUBSTRATE FOR POWER MODULE WITH Ag UNDERLAYER, SUBSTRATE FOR POWER MODULE WITH Ag UNDERLAYER AND POWER MODULE

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014078716A (en) * 2012-10-10 2014-05-01 E.I.Du Pont De Nemours And Company Lamination of polymer thick film conductor compositions
JP2016009731A (en) * 2014-06-24 2016-01-18 コニカミノルタ株式会社 Method and device for forming conductive pattern
US10440831B2 (en) 2014-06-24 2019-10-08 Konica Minolta, Inc. Conductive pattern formation method and conductive pattern formation device
JP2016189397A (en) * 2015-03-30 2016-11-04 三菱マテリアル株式会社 METHOD OF MANUFACTURING SUBSTRATE FOR POWER MODULE WITH Ag UNDERLAYER, SUBSTRATE FOR POWER MODULE WITH Ag UNDERLAYER AND POWER MODULE

Similar Documents

Publication Publication Date Title
JPS5563844A (en) Method of forming insulator between conductive layers
GB2019315B (en) Method of making surface covring
JPS5496775A (en) Method of forming circuit
JPS56107558A (en) Method of forming passivation layer
JPS54140968A (en) Method of forming circuit
JPS5512619A (en) Method of extending conductor
JPS5632608A (en) Method of forming conductive film
JPS5543838A (en) Method of forming conductive layer
JPS5583286A (en) Method of forming conductive layer
JPS553696A (en) Method of postttreating thin layer
JPS5626305A (en) Method of forming conductive coating
JPS5580219A (en) Method of forming metallic contact
JPS54141560A (en) Method of forming epitaxial layer
JPS5546542A (en) Method of forming conductive pattern film
JPS54163396A (en) Method of producing dielectric substance
JPS5494667A (en) Method of forming circuit
JPS54124076A (en) Method of making layer material
JPS5621396A (en) Method of forming conductive passage on substrate
JPS5528286A (en) Method of manufacturing contact
JPS553676A (en) Method of forming conductive pattern
JPS5541722A (en) Method of forming conductive path
JPS554876A (en) Method of forming insulator
JPS5538005A (en) Method of fabricating copperrcoated insulated board
JPS5576510A (en) Method of fabricating insulator
JPS5530014A (en) Method of making structure