JPS5583286A - Method of forming conductive layer - Google Patents
Method of forming conductive layerInfo
- Publication number
- JPS5583286A JPS5583286A JP15964478A JP15964478A JPS5583286A JP S5583286 A JPS5583286 A JP S5583286A JP 15964478 A JP15964478 A JP 15964478A JP 15964478 A JP15964478 A JP 15964478A JP S5583286 A JPS5583286 A JP S5583286A
- Authority
- JP
- Japan
- Prior art keywords
- conductive layer
- forming conductive
- forming
- layer
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15964478A JPS5583286A (en) | 1978-12-20 | 1978-12-20 | Method of forming conductive layer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15964478A JPS5583286A (en) | 1978-12-20 | 1978-12-20 | Method of forming conductive layer |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5583286A true JPS5583286A (en) | 1980-06-23 |
Family
ID=15698208
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15964478A Pending JPS5583286A (en) | 1978-12-20 | 1978-12-20 | Method of forming conductive layer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5583286A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014078716A (en) * | 2012-10-10 | 2014-05-01 | E.I.Du Pont De Nemours And Company | Lamination of polymer thick film conductor compositions |
JP2016009731A (en) * | 2014-06-24 | 2016-01-18 | コニカミノルタ株式会社 | Method and device for forming conductive pattern |
JP2016189397A (en) * | 2015-03-30 | 2016-11-04 | 三菱マテリアル株式会社 | METHOD OF MANUFACTURING SUBSTRATE FOR POWER MODULE WITH Ag UNDERLAYER, SUBSTRATE FOR POWER MODULE WITH Ag UNDERLAYER AND POWER MODULE |
-
1978
- 1978-12-20 JP JP15964478A patent/JPS5583286A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014078716A (en) * | 2012-10-10 | 2014-05-01 | E.I.Du Pont De Nemours And Company | Lamination of polymer thick film conductor compositions |
JP2016009731A (en) * | 2014-06-24 | 2016-01-18 | コニカミノルタ株式会社 | Method and device for forming conductive pattern |
US10440831B2 (en) | 2014-06-24 | 2019-10-08 | Konica Minolta, Inc. | Conductive pattern formation method and conductive pattern formation device |
JP2016189397A (en) * | 2015-03-30 | 2016-11-04 | 三菱マテリアル株式会社 | METHOD OF MANUFACTURING SUBSTRATE FOR POWER MODULE WITH Ag UNDERLAYER, SUBSTRATE FOR POWER MODULE WITH Ag UNDERLAYER AND POWER MODULE |
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