JPS55102255A - Ceramic enclosing device - Google Patents

Ceramic enclosing device

Info

Publication number
JPS55102255A
JPS55102255A JP1008279A JP1008279A JPS55102255A JP S55102255 A JPS55102255 A JP S55102255A JP 1008279 A JP1008279 A JP 1008279A JP 1008279 A JP1008279 A JP 1008279A JP S55102255 A JPS55102255 A JP S55102255A
Authority
JP
Japan
Prior art keywords
ceramic body
end surface
grooves
circular
enclosing device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1008279A
Other languages
Japanese (ja)
Inventor
Katsuaki Sugimoto
Mitsuhiro Nagata
Yutaka Sato
Koji Ishige
Hiroshi Sugawara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP1008279A priority Critical patent/JPS55102255A/en
Publication of JPS55102255A publication Critical patent/JPS55102255A/en
Pending legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To make the outer diameter of a ceramic body small and to make the overall configuration compact by providing grooves along the circumferential direction on the outer surface of a circular or tubular ceramic body, thereby obtaining a long over-the-surface distance between electrodes.
CONSTITUTION: An enclosing device containing a semiconductor element is constituted by a circular-ring shaped alumina-ceramic body 1. Circular grooves 2 are formed along the circumferential direction on the outer surface 1a of the round wall of said enclosing device with a distance being provided between the grooves in the axial direction. The area of the outer surface 1a other than the grooves 2 is made smooth in the axial direction, and the top-end surface 1b and bottome-end surface 1c are made to be a smooth flat plane along the radius direction. Then, metallic- electrode-support rings 3 and 4 are brazed to the top-end surface 1b and the bottom- end surface 1c, respectively. After an element 7 is enclosed in the ceramic body 1, the top and bottom electrodes 5 and 6 are contacted, and are brazed and fixed to the support rings 3 and 4, respectively. Furthermore, a piercing pipe 8 is provided on the ceramic body 1, the air in the inside is replaced by nitrogen gas, thereafter sealing is made.
COPYRIGHT: (C)1980,JPO&Japio
JP1008279A 1979-01-31 1979-01-31 Ceramic enclosing device Pending JPS55102255A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1008279A JPS55102255A (en) 1979-01-31 1979-01-31 Ceramic enclosing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1008279A JPS55102255A (en) 1979-01-31 1979-01-31 Ceramic enclosing device

Publications (1)

Publication Number Publication Date
JPS55102255A true JPS55102255A (en) 1980-08-05

Family

ID=11740419

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1008279A Pending JPS55102255A (en) 1979-01-31 1979-01-31 Ceramic enclosing device

Country Status (1)

Country Link
JP (1) JPS55102255A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7116215B2 (en) * 2003-02-03 2006-10-03 Denso Corporation Sensor device and ceramic package for mounting electronic components

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7116215B2 (en) * 2003-02-03 2006-10-03 Denso Corporation Sensor device and ceramic package for mounting electronic components

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