JPS5497766U - - Google Patents
Info
- Publication number
- JPS5497766U JPS5497766U JP17354077U JP17354077U JPS5497766U JP S5497766 U JPS5497766 U JP S5497766U JP 17354077 U JP17354077 U JP 17354077U JP 17354077 U JP17354077 U JP 17354077U JP S5497766 U JPS5497766 U JP S5497766U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17354077U JPS5497766U (ja) | 1977-12-21 | 1977-12-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17354077U JPS5497766U (ja) | 1977-12-21 | 1977-12-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5497766U true JPS5497766U (ja) | 1979-07-10 |
Family
ID=29179314
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17354077U Pending JPS5497766U (ja) | 1977-12-21 | 1977-12-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5497766U (ja) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57203577U (ja) * | 1981-06-19 | 1982-12-24 | ||
| JP2008034584A (ja) * | 2006-07-28 | 2008-02-14 | Kyocera Corp | 複数個取り配線基板、配線基板、電子装置 |
| JP2011045119A (ja) * | 2001-10-16 | 2011-03-03 | Seiko Epson Corp | 圧電振動片及びその加工方法 |
| JP2013004829A (ja) * | 2011-06-20 | 2013-01-07 | Cmk Corp | 金属ベース集合プリント配線板とその製造方法 |
| JP2014014009A (ja) * | 2012-07-04 | 2014-01-23 | Daishinku Corp | 圧電振動片の製造方法 |
| US8975535B2 (en) | 2009-12-24 | 2015-03-10 | Kyocera Corporation | Many-up wiring substrate, wiring substrate, and electronic device |
-
1977
- 1977-12-21 JP JP17354077U patent/JPS5497766U/ja active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57203577U (ja) * | 1981-06-19 | 1982-12-24 | ||
| JP2011045119A (ja) * | 2001-10-16 | 2011-03-03 | Seiko Epson Corp | 圧電振動片及びその加工方法 |
| JP4735648B2 (ja) * | 2001-10-16 | 2011-07-27 | セイコーエプソン株式会社 | 圧電振動片及びその加工方法 |
| JP2008034584A (ja) * | 2006-07-28 | 2008-02-14 | Kyocera Corp | 複数個取り配線基板、配線基板、電子装置 |
| US8975535B2 (en) | 2009-12-24 | 2015-03-10 | Kyocera Corporation | Many-up wiring substrate, wiring substrate, and electronic device |
| JP5731404B2 (ja) | 2009-12-24 | 2015-06-10 | 京セラ株式会社 | 多数個取り配線基板および配線基板ならびに電子装置 |
| EP2519085B1 (en) * | 2009-12-24 | 2019-02-27 | Kyocera Corporation | Multi-piece wiring substrate, wiring substrate, and electronic device |
| JP2013004829A (ja) * | 2011-06-20 | 2013-01-07 | Cmk Corp | 金属ベース集合プリント配線板とその製造方法 |
| JP2014014009A (ja) * | 2012-07-04 | 2014-01-23 | Daishinku Corp | 圧電振動片の製造方法 |