JPS5494162U - - Google Patents
Info
- Publication number
- JPS5494162U JPS5494162U JP17222477U JP17222477U JPS5494162U JP S5494162 U JPS5494162 U JP S5494162U JP 17222477 U JP17222477 U JP 17222477U JP 17222477 U JP17222477 U JP 17222477U JP S5494162 U JPS5494162 U JP S5494162U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17222477U JPS5494162U (enrdf_load_stackoverflow) | 1977-12-15 | 1977-12-15 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17222477U JPS5494162U (enrdf_load_stackoverflow) | 1977-12-15 | 1977-12-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5494162U true JPS5494162U (enrdf_load_stackoverflow) | 1979-07-03 |
Family
ID=29176822
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17222477U Pending JPS5494162U (enrdf_load_stackoverflow) | 1977-12-15 | 1977-12-15 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5494162U (enrdf_load_stackoverflow) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56110561U (enrdf_load_stackoverflow) * | 1980-01-28 | 1981-08-26 | ||
JP2008533726A (ja) * | 2005-03-16 | 2008-08-21 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | 発光モジュール |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5146263B1 (enrdf_load_stackoverflow) * | 1971-06-14 | 1976-12-08 |
-
1977
- 1977-12-15 JP JP17222477U patent/JPS5494162U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5146263B1 (enrdf_load_stackoverflow) * | 1971-06-14 | 1976-12-08 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56110561U (enrdf_load_stackoverflow) * | 1980-01-28 | 1981-08-26 | ||
JP2008533726A (ja) * | 2005-03-16 | 2008-08-21 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | 発光モジュール |