JPS5488767A - Manufacture for semiconductor element - Google Patents

Manufacture for semiconductor element

Info

Publication number
JPS5488767A
JPS5488767A JP15616577A JP15616577A JPS5488767A JP S5488767 A JPS5488767 A JP S5488767A JP 15616577 A JP15616577 A JP 15616577A JP 15616577 A JP15616577 A JP 15616577A JP S5488767 A JPS5488767 A JP S5488767A
Authority
JP
Japan
Prior art keywords
mutual distance
uniform
space
metal plate
sand blast
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15616577A
Other languages
Japanese (ja)
Inventor
Shinji Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP15616577A priority Critical patent/JPS5488767A/en
Publication of JPS5488767A publication Critical patent/JPS5488767A/en
Pending legal-status Critical Current

Links

Landscapes

  • Drying Of Semiconductors (AREA)
  • Dicing (AREA)

Abstract

PURPOSE: To increase the wafer utilizing rate, by performing sand blast with the metal plate of polygonal angle sticked to the wafer in minimum distance.
CONSTITUTION: When circular metal plates are arranged adjacently in many numbers, the mutual distance g is not uniform. When the metal plate of hexagon is used, the mutual distance g is uniform and the space can be utilized. In general, by using hexagonal metal plates are used to keep the mutual distance constant and performing sand blast, the space disuse can be less.
COPYRIGHT: (C)1979,JPO&Japio
JP15616577A 1977-12-24 1977-12-24 Manufacture for semiconductor element Pending JPS5488767A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15616577A JPS5488767A (en) 1977-12-24 1977-12-24 Manufacture for semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15616577A JPS5488767A (en) 1977-12-24 1977-12-24 Manufacture for semiconductor element

Publications (1)

Publication Number Publication Date
JPS5488767A true JPS5488767A (en) 1979-07-14

Family

ID=15621763

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15616577A Pending JPS5488767A (en) 1977-12-24 1977-12-24 Manufacture for semiconductor element

Country Status (1)

Country Link
JP (1) JPS5488767A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001075954A1 (en) * 2000-03-31 2001-10-11 Toyoda Gosei Co., Ltd. Method for dicing semiconductor wafer into chips
CN106298439A (en) * 2015-05-14 2017-01-04 比亚迪股份有限公司 The processing method of wafer, the method preparing semiconductor element and application thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001075954A1 (en) * 2000-03-31 2001-10-11 Toyoda Gosei Co., Ltd. Method for dicing semiconductor wafer into chips
US7121925B2 (en) 2000-03-31 2006-10-17 Toyoda Gosei Co., Ltd. Method for dicing semiconductor wafer into chips
CN106298439A (en) * 2015-05-14 2017-01-04 比亚迪股份有限公司 The processing method of wafer, the method preparing semiconductor element and application thereof

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