JPS5488767A - Manufacture for semiconductor element - Google Patents
Manufacture for semiconductor elementInfo
- Publication number
- JPS5488767A JPS5488767A JP15616577A JP15616577A JPS5488767A JP S5488767 A JPS5488767 A JP S5488767A JP 15616577 A JP15616577 A JP 15616577A JP 15616577 A JP15616577 A JP 15616577A JP S5488767 A JPS5488767 A JP S5488767A
- Authority
- JP
- Japan
- Prior art keywords
- mutual distance
- uniform
- space
- metal plate
- sand blast
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Drying Of Semiconductors (AREA)
- Dicing (AREA)
Abstract
PURPOSE: To increase the wafer utilizing rate, by performing sand blast with the metal plate of polygonal angle sticked to the wafer in minimum distance.
CONSTITUTION: When circular metal plates are arranged adjacently in many numbers, the mutual distance g is not uniform. When the metal plate of hexagon is used, the mutual distance g is uniform and the space can be utilized. In general, by using hexagonal metal plates are used to keep the mutual distance constant and performing sand blast, the space disuse can be less.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15616577A JPS5488767A (en) | 1977-12-24 | 1977-12-24 | Manufacture for semiconductor element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15616577A JPS5488767A (en) | 1977-12-24 | 1977-12-24 | Manufacture for semiconductor element |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5488767A true JPS5488767A (en) | 1979-07-14 |
Family
ID=15621763
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15616577A Pending JPS5488767A (en) | 1977-12-24 | 1977-12-24 | Manufacture for semiconductor element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5488767A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001075954A1 (en) * | 2000-03-31 | 2001-10-11 | Toyoda Gosei Co., Ltd. | Method for dicing semiconductor wafer into chips |
CN106298439A (en) * | 2015-05-14 | 2017-01-04 | 比亚迪股份有限公司 | The processing method of wafer, the method preparing semiconductor element and application thereof |
-
1977
- 1977-12-24 JP JP15616577A patent/JPS5488767A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001075954A1 (en) * | 2000-03-31 | 2001-10-11 | Toyoda Gosei Co., Ltd. | Method for dicing semiconductor wafer into chips |
US7121925B2 (en) | 2000-03-31 | 2006-10-17 | Toyoda Gosei Co., Ltd. | Method for dicing semiconductor wafer into chips |
CN106298439A (en) * | 2015-05-14 | 2017-01-04 | 比亚迪股份有限公司 | The processing method of wafer, the method preparing semiconductor element and application thereof |
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