JPS5488488A - Device for moulding buffer for packing - Google Patents

Device for moulding buffer for packing

Info

Publication number
JPS5488488A
JPS5488488A JP15715577A JP15715577A JPS5488488A JP S5488488 A JPS5488488 A JP S5488488A JP 15715577 A JP15715577 A JP 15715577A JP 15715577 A JP15715577 A JP 15715577A JP S5488488 A JPS5488488 A JP S5488488A
Authority
JP
Japan
Prior art keywords
foaming
fixed die
packing
buffer
die
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15715577A
Other languages
Japanese (ja)
Other versions
JPS6218425B2 (en
Inventor
Seiji Miura
Hideo Kashiwase
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Original Assignee
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Sanyo Electric Co Ltd, Sanyo Electric Co Ltd filed Critical Tokyo Sanyo Electric Co Ltd
Priority to JP15715577A priority Critical patent/JPS5488488A/en
Publication of JPS5488488A publication Critical patent/JPS5488488A/en
Publication of JPS6218425B2 publication Critical patent/JPS6218425B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Wrappers (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Buffer Packaging (AREA)

Abstract

PURPOSE: To provide buffer for packing for radio instrument and the like having dense portion and coarse portion manufactured by filling foaming materials of different magnifying power of foaming from fixed die into the space between fixed die and movable die.
CONSTITUTION: Hopper 1 and 2 is filled by foaming agent which finished primary foaming and having 50 times and 60 times of magnifying power of foaming respectively, and these agents are transferred through filling port 4 and 5 into the space between fixed die 3 and movable die 8. Then the foaming agent causes secondary foaming is moulded into predeterminded configuration by heating with steam sent from steam feeding pipe 9, 10 in the direction of arrow A. Subsequently, movable die is separatingly moved from fixed die 3 and eject pin 6, 7 are pushed into the direction of arrow B, then the buffer for packing 11 is withdrawn from fixed die 3. Obtained buffer 11 is moulded so as to have upper dense portion and lower coarse portion, therefore, dense portion may be used to contact with the heavyer portion of the instrument to be packed.
COPYRIGHT: (C)1979,JPO&Japio
JP15715577A 1977-12-22 1977-12-22 Device for moulding buffer for packing Granted JPS5488488A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15715577A JPS5488488A (en) 1977-12-22 1977-12-22 Device for moulding buffer for packing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15715577A JPS5488488A (en) 1977-12-22 1977-12-22 Device for moulding buffer for packing

Publications (2)

Publication Number Publication Date
JPS5488488A true JPS5488488A (en) 1979-07-13
JPS6218425B2 JPS6218425B2 (en) 1987-04-22

Family

ID=15643375

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15715577A Granted JPS5488488A (en) 1977-12-22 1977-12-22 Device for moulding buffer for packing

Country Status (1)

Country Link
JP (1) JPS5488488A (en)

Also Published As

Publication number Publication date
JPS6218425B2 (en) 1987-04-22

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