JPS5483100A - Borosiloxane polymer and its preparation - Google Patents

Borosiloxane polymer and its preparation

Info

Publication number
JPS5483100A
JPS5483100A JP14939577A JP14939577A JPS5483100A JP S5483100 A JPS5483100 A JP S5483100A JP 14939577 A JP14939577 A JP 14939577A JP 14939577 A JP14939577 A JP 14939577A JP S5483100 A JPS5483100 A JP S5483100A
Authority
JP
Japan
Prior art keywords
borodiphenylsiloxane
compound
polymer
ceramics
prepared
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14939577A
Other languages
Japanese (ja)
Other versions
JPS616854B2 (en
Inventor
Hiroshi Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Chemical Industry Co Ltd
Original Assignee
Asahi Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Industry Co Ltd filed Critical Asahi Chemical Industry Co Ltd
Priority to JP14939577A priority Critical patent/JPS5483100A/en
Priority to US05/969,006 priority patent/US4228270A/en
Publication of JPS5483100A publication Critical patent/JPS5483100A/en
Publication of JPS616854B2 publication Critical patent/JPS616854B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Silicon Polymers (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)

Abstract

PURPOSE: To prepare a borosiloxane polymer having improved resistance to hydrolysis, in considerably improved yield, by the thermal polycondensation of a borodiphenylsiloxane compound.
CONSTITUTION: A borodiphenylsiloxane polymer having ratios of IR absorption peaks of 0.70W1.20 (δ1340/δ695), and 0.6W1.2(δ1080/δ695), is prepared by heating and polymerizing a borodiphenylsiloxane compound of formula (n is 1,2) in the presence or absence of solvent at 140W400°C. The compound of formula is prepared by reacting boric acid with diphenylsilanediol at 80W140°C.
USE: Hardener of epoxy resin, additive for synthetic fiber, raw material of ceramics, sintering assistant of ceramics, adhesive, raw material of lens, etc.
COPYRIGHT: (C)1979,JPO&Japio
JP14939577A 1977-12-14 1977-12-14 Borosiloxane polymer and its preparation Granted JPS5483100A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP14939577A JPS5483100A (en) 1977-12-14 1977-12-14 Borosiloxane polymer and its preparation
US05/969,006 US4228270A (en) 1977-12-14 1978-12-13 Polyborodiphenylsiloxanes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14939577A JPS5483100A (en) 1977-12-14 1977-12-14 Borosiloxane polymer and its preparation

Publications (2)

Publication Number Publication Date
JPS5483100A true JPS5483100A (en) 1979-07-02
JPS616854B2 JPS616854B2 (en) 1986-03-01

Family

ID=15474182

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14939577A Granted JPS5483100A (en) 1977-12-14 1977-12-14 Borosiloxane polymer and its preparation

Country Status (1)

Country Link
JP (1) JPS5483100A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58201821A (en) * 1982-05-18 1983-11-24 Nippon Ester Co Ltd Preparation of organic silicon polymer
JPS58210976A (en) * 1982-06-02 1983-12-08 Showa Electric Wire & Cable Co Ltd Bonding resin composition
JP2009019104A (en) * 2007-07-11 2009-01-29 Nitto Denko Corp Resin for optical semiconductor element encapsulation containing polyborosiloxane
JP2009127020A (en) * 2007-11-28 2009-06-11 Nitto Denko Corp Photosemiconductor element-sealing resin containing polyborosiloxane, and photosemiconductor device obtained by using the same
JP2009167361A (en) * 2008-01-21 2009-07-30 Nitto Denko Corp Method of producing resin composition for sealing optical semiconductor device
JP2011518893A (en) * 2008-03-04 2011-06-30 ダウ・コーニング・コーポレイション Borosiloxane composition, borosiloxane adhesive, painted substrate and laminated substrate
CN113402714A (en) * 2021-05-25 2021-09-17 长沙达菲新材料科技有限公司 MarkIII type polycarbosilane and preparation method thereof

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58201821A (en) * 1982-05-18 1983-11-24 Nippon Ester Co Ltd Preparation of organic silicon polymer
JPH0216768B2 (en) * 1982-05-18 1990-04-18 Nippon Ester Co Ltd
JPS58210976A (en) * 1982-06-02 1983-12-08 Showa Electric Wire & Cable Co Ltd Bonding resin composition
JPH0356271B2 (en) * 1982-06-02 1991-08-27
JP2009019104A (en) * 2007-07-11 2009-01-29 Nitto Denko Corp Resin for optical semiconductor element encapsulation containing polyborosiloxane
JP2009127020A (en) * 2007-11-28 2009-06-11 Nitto Denko Corp Photosemiconductor element-sealing resin containing polyborosiloxane, and photosemiconductor device obtained by using the same
JP2009167361A (en) * 2008-01-21 2009-07-30 Nitto Denko Corp Method of producing resin composition for sealing optical semiconductor device
JP2011518893A (en) * 2008-03-04 2011-06-30 ダウ・コーニング・コーポレイション Borosiloxane composition, borosiloxane adhesive, painted substrate and laminated substrate
CN113402714A (en) * 2021-05-25 2021-09-17 长沙达菲新材料科技有限公司 MarkIII type polycarbosilane and preparation method thereof

Also Published As

Publication number Publication date
JPS616854B2 (en) 1986-03-01

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