JPS5465798A - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
JPS5465798A
JPS5465798A JP13147777A JP13147777A JPS5465798A JP S5465798 A JPS5465798 A JP S5465798A JP 13147777 A JP13147777 A JP 13147777A JP 13147777 A JP13147777 A JP 13147777A JP S5465798 A JPS5465798 A JP S5465798A
Authority
JP
Japan
Prior art keywords
resin composition
epoxy resin
epoxy
curing agent
low
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13147777A
Other languages
Japanese (ja)
Inventor
Kuniaki Tobukuro
Tadahide Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Priority to JP13147777A priority Critical patent/JPS5465798A/en
Publication of JPS5465798A publication Critical patent/JPS5465798A/en
Pending legal-status Critical Current

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  • Epoxy Resins (AREA)

Abstract

PURPOSE: To provide an epoxy resin composition curable at a low temperature, and suitable for the production of a heat-resistant fiber-reinforced plastic by filament winding process, containing N, N, N', N'-tetraglycidyl metaxylenediamine and metaphenylenediamine.
CONSTITUTION: An epoxy resin composition containing a low-viscosity, polyfunctional N, N, N', N'-tetraglycidyl metaxylenediamine as epoxy component, and metaphenylene-diamine as curing agent. The amount of the curing agent is pref. 0.8-1.2 equivalent per 1 equivalent of the epoxy component.
EFFECT: The resin composition has a low viscosity and long pot-life, and is suitable also as a cast molding and resin injection molding resin composition. The composition may contain fillers such as anhydrous silica, pigments, etc.
COPYRIGHT: (C)1979,JPO&Japio
JP13147777A 1977-11-04 1977-11-04 Epoxy resin composition Pending JPS5465798A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13147777A JPS5465798A (en) 1977-11-04 1977-11-04 Epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13147777A JPS5465798A (en) 1977-11-04 1977-11-04 Epoxy resin composition

Publications (1)

Publication Number Publication Date
JPS5465798A true JPS5465798A (en) 1979-05-26

Family

ID=15058881

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13147777A Pending JPS5465798A (en) 1977-11-04 1977-11-04 Epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS5465798A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59191786A (en) * 1983-04-15 1984-10-30 Mitsui Petrochem Ind Ltd Adhesive for ferrite

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59191786A (en) * 1983-04-15 1984-10-30 Mitsui Petrochem Ind Ltd Adhesive for ferrite

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