JPS51124197A - A resin composition - Google Patents

A resin composition

Info

Publication number
JPS51124197A
JPS51124197A JP4882975A JP4882975A JPS51124197A JP S51124197 A JPS51124197 A JP S51124197A JP 4882975 A JP4882975 A JP 4882975A JP 4882975 A JP4882975 A JP 4882975A JP S51124197 A JPS51124197 A JP S51124197A
Authority
JP
Japan
Prior art keywords
resin composition
gloss
curing agent
acid derivatives
coating resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4882975A
Other languages
Japanese (ja)
Other versions
JPS5833243B2 (en
Inventor
Noboru Ishikawa
Yoichi Murakami
Akio Shoji
Koichiro Adachi
Jitsuo Kurokawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kawamura Institute of Chemical Research
DIC Corp
Original Assignee
Kawamura Institute of Chemical Research
Dainippon Ink and Chemicals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kawamura Institute of Chemical Research, Dainippon Ink and Chemicals Co Ltd filed Critical Kawamura Institute of Chemical Research
Priority to JP4882975A priority Critical patent/JPS5833243B2/en
Publication of JPS51124197A publication Critical patent/JPS51124197A/en
Publication of JPS5833243B2 publication Critical patent/JPS5833243B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Epoxy Resins (AREA)
  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE: A power coating resin composition having improved smoothness and gloss of cured surface containing specified trihydroxyethyl isocyanuric acid derivatives as curing agent.
COPYRIGHT: (C)1976,JPO&Japio
JP4882975A 1975-04-22 1975-04-22 Jyushiso Saibutsu Expired JPS5833243B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4882975A JPS5833243B2 (en) 1975-04-22 1975-04-22 Jyushiso Saibutsu

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4882975A JPS5833243B2 (en) 1975-04-22 1975-04-22 Jyushiso Saibutsu

Publications (2)

Publication Number Publication Date
JPS51124197A true JPS51124197A (en) 1976-10-29
JPS5833243B2 JPS5833243B2 (en) 1983-07-19

Family

ID=12814108

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4882975A Expired JPS5833243B2 (en) 1975-04-22 1975-04-22 Jyushiso Saibutsu

Country Status (1)

Country Link
JP (1) JPS5833243B2 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01193317A (en) * 1987-11-27 1989-08-03 Enichem Sintesi Spa Thermosetting liquid composition
WO2016013257A1 (en) * 2014-07-24 2016-01-28 日本化薬株式会社 Polycarboxylic acid, polycarboxylic acid composition, epoxy resin composition and heat-curable resin composition each containing said polycarboxylic acid, cured products of said compositions, and optical semiconductor device
JP2016141806A (en) * 2015-02-05 2016-08-08 日本化薬株式会社 Polycarboxylic acid resin, thermosetting resin composition using the same and optical semiconductor device using the thermosetting resin composition as encapsulation material or reflector
WO2016125874A1 (en) * 2015-02-05 2016-08-11 日本化薬株式会社 Thermosetting resin composition including polyhydric alcohol compound, acid anhydride compound and thermosetting resin, polycarboxylic acid resin, thermosetting resin composition using same, and photosemiconductor device using either one of the thermosetting resin compositions as sealing material or reflective material
WO2016136281A1 (en) * 2015-02-27 2016-09-01 クラスターテクノロジー株式会社 Curable epoxy resin composition for white reflector molding, cured product of same, substrate for optical semiconductor element mounting, and optical semiconductor device
WO2017082170A1 (en) * 2015-11-09 2017-05-18 中央発條株式会社 Flocking powder coating method
WO2017082252A1 (en) * 2015-11-09 2017-05-18 中央発條株式会社 Flocking powder coated article

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01193317A (en) * 1987-11-27 1989-08-03 Enichem Sintesi Spa Thermosetting liquid composition
CN106795125A (en) * 2014-07-24 2017-05-31 日本化药株式会社 Polybasic carboxylic acid and the polycarboxylic acid compositions containing it, composition epoxy resin, hot curing resin composition, their solidfied material and optical semiconductor device
WO2016013257A1 (en) * 2014-07-24 2016-01-28 日本化薬株式会社 Polycarboxylic acid, polycarboxylic acid composition, epoxy resin composition and heat-curable resin composition each containing said polycarboxylic acid, cured products of said compositions, and optical semiconductor device
WO2016013642A1 (en) * 2014-07-24 2016-01-28 日本化薬株式会社 Polycarboxylic acid and polycarboxylic acid composition containing same, epoxy resin composition, thermosetting resin composition, and cured material of same, and optical semiconductor device
JP5864031B1 (en) * 2014-07-24 2016-02-17 日本化薬株式会社 Polyvalent carboxylic acid and polyvalent carboxylic acid composition, epoxy resin composition, thermosetting resin composition, cured product thereof, and optical semiconductor device containing the same
JP2016135764A (en) * 2014-07-24 2016-07-28 日本化薬株式会社 Polyvalent carboxylic acid and polyvalent carboxylic acid composition containing the same, epoxy resin composition, thermosetting resin composition, cured article thereof, and optical semiconductor device
CN107074785A (en) * 2014-07-24 2017-08-18 日本化药株式会社 Polybasic carboxylic acid and polycarboxylic acid compositions, composition epoxy resin, hot curing resin composition, their solidfied material and optical semiconductor device containing it
WO2016125874A1 (en) * 2015-02-05 2016-08-11 日本化薬株式会社 Thermosetting resin composition including polyhydric alcohol compound, acid anhydride compound and thermosetting resin, polycarboxylic acid resin, thermosetting resin composition using same, and photosemiconductor device using either one of the thermosetting resin compositions as sealing material or reflective material
JP2016141806A (en) * 2015-02-05 2016-08-08 日本化薬株式会社 Polycarboxylic acid resin, thermosetting resin composition using the same and optical semiconductor device using the thermosetting resin composition as encapsulation material or reflector
CN107250282A (en) * 2015-02-05 2017-10-13 日本化药株式会社 Hot curing resin composition and Polycarboxylic acid resin containing polyol compound, anhydride compound and heat-curing resin and its hot curing resin composition is used and has used any of foregoing hot curing resin composition as encapsulating material or the optical semiconductor device of reflecting material
WO2016136281A1 (en) * 2015-02-27 2016-09-01 クラスターテクノロジー株式会社 Curable epoxy resin composition for white reflector molding, cured product of same, substrate for optical semiconductor element mounting, and optical semiconductor device
WO2017082170A1 (en) * 2015-11-09 2017-05-18 中央発條株式会社 Flocking powder coating method
WO2017082252A1 (en) * 2015-11-09 2017-05-18 中央発條株式会社 Flocking powder coated article
US11007549B2 (en) 2015-11-09 2021-05-18 Chuo Hatsujo Kabushiki Kaisha Flocking powder coated article

Also Published As

Publication number Publication date
JPS5833243B2 (en) 1983-07-19

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