JPS51124197A - A resin composition - Google Patents
A resin compositionInfo
- Publication number
- JPS51124197A JPS51124197A JP4882975A JP4882975A JPS51124197A JP S51124197 A JPS51124197 A JP S51124197A JP 4882975 A JP4882975 A JP 4882975A JP 4882975 A JP4882975 A JP 4882975A JP S51124197 A JPS51124197 A JP S51124197A
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- gloss
- curing agent
- acid derivatives
- coating resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Epoxy Resins (AREA)
- Paints Or Removers (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
PURPOSE: A power coating resin composition having improved smoothness and gloss of cured surface containing specified trihydroxyethyl isocyanuric acid derivatives as curing agent.
COPYRIGHT: (C)1976,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4882975A JPS5833243B2 (en) | 1975-04-22 | 1975-04-22 | Jyushiso Saibutsu |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4882975A JPS5833243B2 (en) | 1975-04-22 | 1975-04-22 | Jyushiso Saibutsu |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS51124197A true JPS51124197A (en) | 1976-10-29 |
JPS5833243B2 JPS5833243B2 (en) | 1983-07-19 |
Family
ID=12814108
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4882975A Expired JPS5833243B2 (en) | 1975-04-22 | 1975-04-22 | Jyushiso Saibutsu |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5833243B2 (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01193317A (en) * | 1987-11-27 | 1989-08-03 | Enichem Sintesi Spa | Thermosetting liquid composition |
WO2016013257A1 (en) * | 2014-07-24 | 2016-01-28 | 日本化薬株式会社 | Polycarboxylic acid, polycarboxylic acid composition, epoxy resin composition and heat-curable resin composition each containing said polycarboxylic acid, cured products of said compositions, and optical semiconductor device |
JP2016141806A (en) * | 2015-02-05 | 2016-08-08 | 日本化薬株式会社 | Polycarboxylic acid resin, thermosetting resin composition using the same and optical semiconductor device using the thermosetting resin composition as encapsulation material or reflector |
WO2016125874A1 (en) * | 2015-02-05 | 2016-08-11 | 日本化薬株式会社 | Thermosetting resin composition including polyhydric alcohol compound, acid anhydride compound and thermosetting resin, polycarboxylic acid resin, thermosetting resin composition using same, and photosemiconductor device using either one of the thermosetting resin compositions as sealing material or reflective material |
WO2016136281A1 (en) * | 2015-02-27 | 2016-09-01 | クラスターテクノロジー株式会社 | Curable epoxy resin composition for white reflector molding, cured product of same, substrate for optical semiconductor element mounting, and optical semiconductor device |
WO2017082170A1 (en) * | 2015-11-09 | 2017-05-18 | 中央発條株式会社 | Flocking powder coating method |
WO2017082252A1 (en) * | 2015-11-09 | 2017-05-18 | 中央発條株式会社 | Flocking powder coated article |
-
1975
- 1975-04-22 JP JP4882975A patent/JPS5833243B2/en not_active Expired
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01193317A (en) * | 1987-11-27 | 1989-08-03 | Enichem Sintesi Spa | Thermosetting liquid composition |
CN106795125A (en) * | 2014-07-24 | 2017-05-31 | 日本化药株式会社 | Polybasic carboxylic acid and the polycarboxylic acid compositions containing it, composition epoxy resin, hot curing resin composition, their solidfied material and optical semiconductor device |
WO2016013257A1 (en) * | 2014-07-24 | 2016-01-28 | 日本化薬株式会社 | Polycarboxylic acid, polycarboxylic acid composition, epoxy resin composition and heat-curable resin composition each containing said polycarboxylic acid, cured products of said compositions, and optical semiconductor device |
WO2016013642A1 (en) * | 2014-07-24 | 2016-01-28 | 日本化薬株式会社 | Polycarboxylic acid and polycarboxylic acid composition containing same, epoxy resin composition, thermosetting resin composition, and cured material of same, and optical semiconductor device |
JP5864031B1 (en) * | 2014-07-24 | 2016-02-17 | 日本化薬株式会社 | Polyvalent carboxylic acid and polyvalent carboxylic acid composition, epoxy resin composition, thermosetting resin composition, cured product thereof, and optical semiconductor device containing the same |
JP2016135764A (en) * | 2014-07-24 | 2016-07-28 | 日本化薬株式会社 | Polyvalent carboxylic acid and polyvalent carboxylic acid composition containing the same, epoxy resin composition, thermosetting resin composition, cured article thereof, and optical semiconductor device |
CN107074785A (en) * | 2014-07-24 | 2017-08-18 | 日本化药株式会社 | Polybasic carboxylic acid and polycarboxylic acid compositions, composition epoxy resin, hot curing resin composition, their solidfied material and optical semiconductor device containing it |
WO2016125874A1 (en) * | 2015-02-05 | 2016-08-11 | 日本化薬株式会社 | Thermosetting resin composition including polyhydric alcohol compound, acid anhydride compound and thermosetting resin, polycarboxylic acid resin, thermosetting resin composition using same, and photosemiconductor device using either one of the thermosetting resin compositions as sealing material or reflective material |
JP2016141806A (en) * | 2015-02-05 | 2016-08-08 | 日本化薬株式会社 | Polycarboxylic acid resin, thermosetting resin composition using the same and optical semiconductor device using the thermosetting resin composition as encapsulation material or reflector |
CN107250282A (en) * | 2015-02-05 | 2017-10-13 | 日本化药株式会社 | Hot curing resin composition and Polycarboxylic acid resin containing polyol compound, anhydride compound and heat-curing resin and its hot curing resin composition is used and has used any of foregoing hot curing resin composition as encapsulating material or the optical semiconductor device of reflecting material |
WO2016136281A1 (en) * | 2015-02-27 | 2016-09-01 | クラスターテクノロジー株式会社 | Curable epoxy resin composition for white reflector molding, cured product of same, substrate for optical semiconductor element mounting, and optical semiconductor device |
WO2017082170A1 (en) * | 2015-11-09 | 2017-05-18 | 中央発條株式会社 | Flocking powder coating method |
WO2017082252A1 (en) * | 2015-11-09 | 2017-05-18 | 中央発條株式会社 | Flocking powder coated article |
US11007549B2 (en) | 2015-11-09 | 2021-05-18 | Chuo Hatsujo Kabushiki Kaisha | Flocking powder coated article |
Also Published As
Publication number | Publication date |
---|---|
JPS5833243B2 (en) | 1983-07-19 |
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