JPS547575A - Way of mounting electronic parts - Google Patents
Way of mounting electronic partsInfo
- Publication number
- JPS547575A JPS547575A JP7211577A JP7211577A JPS547575A JP S547575 A JPS547575 A JP S547575A JP 7211577 A JP7211577 A JP 7211577A JP 7211577 A JP7211577 A JP 7211577A JP S547575 A JPS547575 A JP S547575A
- Authority
- JP
- Japan
- Prior art keywords
- way
- electronic parts
- mounting electronic
- mounting
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Packaging Frangible Articles (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7211577A JPS547575A (en) | 1977-06-20 | 1977-06-20 | Way of mounting electronic parts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7211577A JPS547575A (en) | 1977-06-20 | 1977-06-20 | Way of mounting electronic parts |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS547575A true JPS547575A (en) | 1979-01-20 |
JPS5538071B2 JPS5538071B2 (ja) | 1980-10-02 |
Family
ID=13480032
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7211577A Granted JPS547575A (en) | 1977-06-20 | 1977-06-20 | Way of mounting electronic parts |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS547575A (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5626492A (en) * | 1979-08-13 | 1981-03-14 | Matsushita Electric Ind Co Ltd | Device for mouting cylindrical leadless electronic part |
JPS57104572U (ja) * | 1980-12-17 | 1982-06-28 | ||
JPS62291199A (ja) * | 1986-06-11 | 1987-12-17 | 松下電器産業株式会社 | チツプ部品の整列外観検査方法 |
JPH01202900A (ja) * | 1988-02-08 | 1989-08-15 | Matsushita Electric Ind Co Ltd | 部品装着方法 |
WO2003016623A1 (en) * | 2001-08-15 | 2003-02-27 | Basf Corporation | Copolymeric binder for paperboard coatings with improved glueability and associated methods |
JP2006173190A (ja) * | 2004-12-13 | 2006-06-29 | Hitachi Chem Co Ltd | 半導体装置の製造方法及びicチップ配列用支持材 |
-
1977
- 1977-06-20 JP JP7211577A patent/JPS547575A/ja active Granted
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5626492A (en) * | 1979-08-13 | 1981-03-14 | Matsushita Electric Ind Co Ltd | Device for mouting cylindrical leadless electronic part |
JPS6214120B2 (ja) * | 1979-08-13 | 1987-03-31 | Matsushita Electric Ind Co Ltd | |
JPS57104572U (ja) * | 1980-12-17 | 1982-06-28 | ||
JPS62291199A (ja) * | 1986-06-11 | 1987-12-17 | 松下電器産業株式会社 | チツプ部品の整列外観検査方法 |
JPH01202900A (ja) * | 1988-02-08 | 1989-08-15 | Matsushita Electric Ind Co Ltd | 部品装着方法 |
WO2003016623A1 (en) * | 2001-08-15 | 2003-02-27 | Basf Corporation | Copolymeric binder for paperboard coatings with improved glueability and associated methods |
JP2006173190A (ja) * | 2004-12-13 | 2006-06-29 | Hitachi Chem Co Ltd | 半導体装置の製造方法及びicチップ配列用支持材 |
Also Published As
Publication number | Publication date |
---|---|
JPS5538071B2 (ja) | 1980-10-02 |
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