JPS5472484U - - Google Patents

Info

Publication number
JPS5472484U
JPS5472484U JP15238278U JP15238278U JPS5472484U JP S5472484 U JPS5472484 U JP S5472484U JP 15238278 U JP15238278 U JP 15238278U JP 15238278 U JP15238278 U JP 15238278U JP S5472484 U JPS5472484 U JP S5472484U
Authority
JP
Japan
Prior art keywords
source
injected
larger
current
light flux
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15238278U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5472484U publication Critical patent/JPS5472484U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0756—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements

Abstract

Several elementary light sources are connected in series and energized simultaneously to emit electroluminescent radiation at different wavelengths. The light flux emitted by a first source is larger than that of the second source when a current is injected into each source, and the light flux of the second source is larger than that of the first source when a current of a different intensity is injected into each source.
JP15238278U 1972-12-13 1978-11-07 Pending JPS5472484U (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7244359A FR2248663B1 (en) 1972-12-13 1972-12-13

Publications (1)

Publication Number Publication Date
JPS5472484U true JPS5472484U (en) 1979-05-23

Family

ID=9108628

Family Applications (2)

Application Number Title Priority Date Filing Date
JP13822873A Expired JPS529994B2 (en) 1972-12-13 1973-12-13
JP15238278U Pending JPS5472484U (en) 1972-12-13 1978-11-07

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP13822873A Expired JPS529994B2 (en) 1972-12-13 1973-12-13

Country Status (7)

Country Link
US (1) US3875473A (en)
JP (2) JPS529994B2 (en)
CA (1) CA1011440A (en)
DE (1) DE2361531C3 (en)
FR (1) FR2248663B1 (en)
GB (1) GB1459455A (en)
IT (1) IT1001409B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9130130B2 (en) 1996-07-29 2015-09-08 Nichia Corporation Light emitting device and display comprising a plurality of light emitting components on mount

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US4063231A (en) * 1976-10-26 1977-12-13 Modern Controls, Inc. Visual display apparatus
US4488149A (en) * 1981-02-26 1984-12-11 Givens Jr William A Electronic display having segments wherein each segment is capable of selectively illuminating two colors
FR2520934B1 (en) * 1982-01-29 1985-06-07 Radiotechnique Compelec MULTI-CRYSTAL LIGHT EMITTING SEMICONDUCTOR DEVICE
US4780643A (en) * 1983-03-30 1988-10-25 Minnesota Mining And Manufacturing Company Semiconductor electrodes having multicolor luminescence
US4857801A (en) * 1983-04-18 1989-08-15 Litton Systems Canada Limited Dense LED matrix for high resolution full color video
US4559116A (en) * 1984-07-09 1985-12-17 Minnesota Mining And Manufacturing Company Process of etching semiconductor electrodes
US4864370A (en) * 1987-11-16 1989-09-05 Motorola, Inc. Electrical contact for an LED
US5707891A (en) * 1989-04-28 1998-01-13 Sharp Kabushiki Kaisha Method of manufacturing a light emitting diode
US5652178A (en) * 1989-04-28 1997-07-29 Sharp Kabushiki Kaisha Method of manufacturing a light emitting diode using LPE at different temperatures
DE3940853A1 (en) * 1989-12-11 1991-06-13 Balzers Hochvakuum ARRANGEMENT FOR LEVELING LIQUID GASES
US6274890B1 (en) 1997-01-15 2001-08-14 Kabushiki Kaisha Toshiba Semiconductor light emitting device and its manufacturing method
TW408497B (en) * 1997-11-25 2000-10-11 Matsushita Electric Works Ltd LED illuminating apparatus
DE19952932C1 (en) * 1999-11-03 2001-05-03 Osram Opto Semiconductors Gmbh LED white light source with broadband excitation
US6513949B1 (en) * 1999-12-02 2003-02-04 Koninklijke Philips Electronics N.V. LED/phosphor-LED hybrid lighting systems
US6666567B1 (en) 1999-12-28 2003-12-23 Honeywell International Inc. Methods and apparatus for a light source with a raised LED structure
US7320632B2 (en) 2000-06-15 2008-01-22 Lednium Pty Limited Method of producing a lamp
AUPQ818100A0 (en) 2000-06-15 2000-07-06 Arlec Australia Limited Led lamp
US6525464B1 (en) * 2000-09-08 2003-02-25 Unity Opto Technology Co., Ltd. Stacked light-mixing LED
JP2002314143A (en) * 2001-04-09 2002-10-25 Toshiba Corp Light emitting device
JP4101468B2 (en) * 2001-04-09 2008-06-18 豊田合成株式会社 Method for manufacturing light emitting device
US6841931B2 (en) * 2001-04-12 2005-01-11 Toyoda Gosei Co., Ltd. LED lamp
CN1663044A (en) * 2002-06-14 2005-08-31 莱尼股份有限公司 Lamp and method of producing a lamp
TW591811B (en) * 2003-01-02 2004-06-11 Epitech Technology Corp Ltd Color mixing light emitting diode
TW200507226A (en) * 2003-03-12 2005-02-16 Lednium Pty Ltd A lamp and a process for producing a lamp
EP1475835A3 (en) * 2003-04-14 2004-12-15 Epitech Corporation, Ltd. Color mixing light emitting diode
US7204050B2 (en) * 2003-12-29 2007-04-17 Sargent Manufacturing Company Exit device with lighted touchpad
US7339332B2 (en) * 2004-05-24 2008-03-04 Honeywell International, Inc. Chroma compensated backlit display
EP2144286A3 (en) * 2004-06-30 2011-03-30 Seoul Opto Device Co., Ltd. Light emitting element with a plurality of light emitting diodes bonded, method of manufacturing the same, and light emitting device using the same
KR20080080171A (en) * 2005-12-14 2008-09-02 코닌클리즈케 필립스 일렉트로닉스 엔.브이. Solid-state light source and method of producing light of a desired color point
US20070274093A1 (en) * 2006-05-25 2007-11-29 Honeywell International, Inc. LED backlight system for LCD displays
DE102006035658B4 (en) 2006-07-31 2013-07-18 Ivoclar Vivadent Ag Hand-held light curing device
DE102007011637A1 (en) * 2007-03-09 2008-09-18 Ivoclar Vivadent Ag Light emitting device
CN102341740B (en) * 2009-06-22 2015-09-16 财团法人工业技术研究院 Array of light emitting cells, its manufacture method and projector equipment

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Publication number Priority date Publication date Assignee Title
US3499158A (en) * 1964-04-24 1970-03-03 Raytheon Co Circuits utilizing the threshold properties of recombination radiation semiconductor devices
US3603833A (en) * 1970-02-16 1971-09-07 Bell Telephone Labor Inc Electroluminescent junction semiconductor with controllable combination colors
US3740570A (en) * 1971-09-27 1973-06-19 Litton Systems Inc Driving circuits for light emitting diodes

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9130130B2 (en) 1996-07-29 2015-09-08 Nichia Corporation Light emitting device and display comprising a plurality of light emitting components on mount

Also Published As

Publication number Publication date
JPS49100988A (en) 1974-09-24
DE2361531A1 (en) 1974-06-20
FR2248663B1 (en) 1978-08-11
CA1011440A (en) 1977-05-31
DE2361531B2 (en) 1981-05-21
DE2361531C3 (en) 1982-01-21
GB1459455A (en) 1976-12-22
US3875473A (en) 1975-04-01
JPS529994B2 (en) 1977-03-19
FR2248663A1 (en) 1975-05-16
IT1001409B (en) 1976-04-20

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