IT1001409B - PO LYCHROMATIC ELECTROLUMINESCENT DEVICE - Google Patents

PO LYCHROMATIC ELECTROLUMINESCENT DEVICE

Info

Publication number
IT1001409B
IT1001409B IT298273A IT298273A IT1001409B IT 1001409 B IT1001409 B IT 1001409B IT 298273 A IT298273 A IT 298273A IT 298273 A IT298273 A IT 298273A IT 1001409 B IT1001409 B IT 1001409B
Authority
IT
Italy
Prior art keywords
source
lychromatic
electroluminescent device
injected
larger
Prior art date
Application number
IT298273A
Other languages
Italian (it)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Application granted granted Critical
Publication of IT1001409B publication Critical patent/IT1001409B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0756—Stacked arrangements of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Devices (AREA)
  • Led Device Packages (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)

Abstract

Several elementary light sources are connected in series and energized simultaneously to emit electroluminescent radiation at different wavelengths. The light flux emitted by a first source is larger than that of the second source when a current is injected into each source, and the light flux of the second source is larger than that of the first source when a current of a different intensity is injected into each source.
IT298273A 1972-12-13 1973-12-12 PO LYCHROMATIC ELECTROLUMINESCENT DEVICE IT1001409B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7244359A FR2248663B1 (en) 1972-12-13 1972-12-13

Publications (1)

Publication Number Publication Date
IT1001409B true IT1001409B (en) 1976-04-20

Family

ID=9108628

Family Applications (1)

Application Number Title Priority Date Filing Date
IT298273A IT1001409B (en) 1972-12-13 1973-12-12 PO LYCHROMATIC ELECTROLUMINESCENT DEVICE

Country Status (7)

Country Link
US (1) US3875473A (en)
JP (2) JPS529994B2 (en)
CA (1) CA1011440A (en)
DE (1) DE2361531C3 (en)
FR (1) FR2248663B1 (en)
GB (1) GB1459455A (en)
IT (1) IT1001409B (en)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4063231A (en) * 1976-10-26 1977-12-13 Modern Controls, Inc. Visual display apparatus
US4488149A (en) * 1981-02-26 1984-12-11 Givens Jr William A Electronic display having segments wherein each segment is capable of selectively illuminating two colors
FR2520934B1 (en) * 1982-01-29 1985-06-07 Radiotechnique Compelec MULTI-CRYSTAL LIGHT EMITTING SEMICONDUCTOR DEVICE
US4780643A (en) * 1983-03-30 1988-10-25 Minnesota Mining And Manufacturing Company Semiconductor electrodes having multicolor luminescence
US4857801A (en) * 1983-04-18 1989-08-15 Litton Systems Canada Limited Dense LED matrix for high resolution full color video
US4559116A (en) * 1984-07-09 1985-12-17 Minnesota Mining And Manufacturing Company Process of etching semiconductor electrodes
US4864370A (en) * 1987-11-16 1989-09-05 Motorola, Inc. Electrical contact for an LED
US5707891A (en) * 1989-04-28 1998-01-13 Sharp Kabushiki Kaisha Method of manufacturing a light emitting diode
US5652178A (en) * 1989-04-28 1997-07-29 Sharp Kabushiki Kaisha Method of manufacturing a light emitting diode using LPE at different temperatures
DE3940853A1 (en) * 1989-12-11 1991-06-13 Balzers Hochvakuum ARRANGEMENT FOR LEVELING LIQUID GASES
TW383508B (en) 1996-07-29 2000-03-01 Nichia Kagaku Kogyo Kk Light emitting device and display
US6274890B1 (en) 1997-01-15 2001-08-14 Kabushiki Kaisha Toshiba Semiconductor light emitting device and its manufacturing method
TW408497B (en) * 1997-11-25 2000-10-11 Matsushita Electric Works Ltd LED illuminating apparatus
DE19952932C1 (en) * 1999-11-03 2001-05-03 Osram Opto Semiconductors Gmbh LED white light source with broadband excitation
US6513949B1 (en) * 1999-12-02 2003-02-04 Koninklijke Philips Electronics N.V. LED/phosphor-LED hybrid lighting systems
US6666567B1 (en) 1999-12-28 2003-12-23 Honeywell International Inc. Methods and apparatus for a light source with a raised LED structure
AUPQ818100A0 (en) 2000-06-15 2000-07-06 Arlec Australia Limited Led lamp
US7320632B2 (en) 2000-06-15 2008-01-22 Lednium Pty Limited Method of producing a lamp
US6525464B1 (en) * 2000-09-08 2003-02-25 Unity Opto Technology Co., Ltd. Stacked light-mixing LED
JP2002314143A (en) * 2001-04-09 2002-10-25 Toshiba Corp Light emitting device
JP4101468B2 (en) * 2001-04-09 2008-06-18 豊田合成株式会社 Method for manufacturing light emitting device
US6841931B2 (en) * 2001-04-12 2005-01-11 Toyoda Gosei Co., Ltd. LED lamp
KR20080064904A (en) 2002-06-14 2008-07-09 레드니엄 테크놀로지 피티와이 리미티드 LED packaging method and packaged LED
TW591811B (en) * 2003-01-02 2004-06-11 Epitech Technology Corp Ltd Color mixing light emitting diode
KR20060015712A (en) * 2003-03-12 2006-02-20 레드니엄 피티와이 리미티드 Lamp and lamp manufacturing method
EP1475835A3 (en) * 2003-04-14 2004-12-15 Epitech Corporation, Ltd. Color mixing light emitting diode
US7204050B2 (en) * 2003-12-29 2007-04-17 Sargent Manufacturing Company Exit device with lighted touchpad
US7339332B2 (en) * 2004-05-24 2008-03-04 Honeywell International, Inc. Chroma compensated backlit display
EP2733744A1 (en) * 2004-06-30 2014-05-21 Seoul Viosys Co., Ltd Light emitting element comprising a plurality of vertical-type LEDs connected in series on the same carrier substrate
WO2007069148A2 (en) * 2005-12-14 2007-06-21 Koninklijke Philips Electronics N.V. Semiconductor light source and method of producing light of a desired color point
US20070274093A1 (en) * 2006-05-25 2007-11-29 Honeywell International, Inc. LED backlight system for LCD displays
DE102006035658B4 (en) 2006-07-31 2013-07-18 Ivoclar Vivadent Ag Hand-held light curing device
DE102007011637A1 (en) * 2007-03-09 2008-09-18 Ivoclar Vivadent Ag Light emitting device
CN102341740B (en) * 2009-06-22 2015-09-16 财团法人工业技术研究院 Light-emitting unit array, its manufacturing method and projection device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3499158A (en) * 1964-04-24 1970-03-03 Raytheon Co Circuits utilizing the threshold properties of recombination radiation semiconductor devices
US3603833A (en) * 1970-02-16 1971-09-07 Bell Telephone Labor Inc Electroluminescent junction semiconductor with controllable combination colors
US3740570A (en) * 1971-09-27 1973-06-19 Litton Systems Inc Driving circuits for light emitting diodes

Also Published As

Publication number Publication date
CA1011440A (en) 1977-05-31
DE2361531A1 (en) 1974-06-20
JPS529994B2 (en) 1977-03-19
FR2248663B1 (en) 1978-08-11
DE2361531C3 (en) 1982-01-21
JPS49100988A (en) 1974-09-24
GB1459455A (en) 1976-12-22
DE2361531B2 (en) 1981-05-21
US3875473A (en) 1975-04-01
JPS5472484U (en) 1979-05-23
FR2248663A1 (en) 1975-05-16

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