JPS5458870A - Method of molding mold of electronic device - Google Patents
Method of molding mold of electronic deviceInfo
- Publication number
- JPS5458870A JPS5458870A JP12560977A JP12560977A JPS5458870A JP S5458870 A JPS5458870 A JP S5458870A JP 12560977 A JP12560977 A JP 12560977A JP 12560977 A JP12560977 A JP 12560977A JP S5458870 A JPS5458870 A JP S5458870A
- Authority
- JP
- Japan
- Prior art keywords
- electronic device
- molding mold
- mold
- molding
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12560977A JPS5458870A (en) | 1977-10-18 | 1977-10-18 | Method of molding mold of electronic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12560977A JPS5458870A (en) | 1977-10-18 | 1977-10-18 | Method of molding mold of electronic device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5458870A true JPS5458870A (en) | 1979-05-11 |
JPS5620703B2 JPS5620703B2 (en) | 1981-05-15 |
Family
ID=14914332
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12560977A Granted JPS5458870A (en) | 1977-10-18 | 1977-10-18 | Method of molding mold of electronic device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5458870A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6099591U (en) * | 1983-12-12 | 1985-07-06 | 株式会社 指月電機製作所 | circuit unit |
JPS60172374U (en) * | 1984-04-23 | 1985-11-15 | 株式会社 指月電機製作所 | circuit unit |
JPS633021U (en) * | 1986-06-25 | 1988-01-09 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS48140U (en) * | 1971-05-22 | 1973-01-05 | ||
JPS4811348U (en) * | 1971-06-18 | 1973-02-08 | ||
JPS5023093U (en) * | 1973-06-26 | 1975-03-14 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4811348B1 (en) * | 1967-09-21 | 1973-04-12 |
-
1977
- 1977-10-18 JP JP12560977A patent/JPS5458870A/en active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS48140U (en) * | 1971-05-22 | 1973-01-05 | ||
JPS4811348U (en) * | 1971-06-18 | 1973-02-08 | ||
JPS5023093U (en) * | 1973-06-26 | 1975-03-14 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6099591U (en) * | 1983-12-12 | 1985-07-06 | 株式会社 指月電機製作所 | circuit unit |
JPS60172374U (en) * | 1984-04-23 | 1985-11-15 | 株式会社 指月電機製作所 | circuit unit |
JPS633021U (en) * | 1986-06-25 | 1988-01-09 |
Also Published As
Publication number | Publication date |
---|---|
JPS5620703B2 (en) | 1981-05-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5421422A (en) | Method of pouring moldings into mold | |
JPS55130827A (en) | Method of forming glass molding mold | |
JPS5441229A (en) | Method of making mold | |
JPS5438220A (en) | Method of maiking mold | |
JPS5425468A (en) | Molding and mounting device for electronic parts | |
JPS5458870A (en) | Method of molding mold of electronic device | |
JPS5493064A (en) | Mold apparatus | |
JPS53147623A (en) | Method of molding mold and its device | |
JPS5434056A (en) | Method of molding electronic device | |
JPS542925A (en) | Method of making mold | |
JPS53143966A (en) | Method of moulding electronic device | |
JPS5483960A (en) | Method of making mold for plastics | |
JPS5387929A (en) | Method of molding thin mold | |
JPS52147766A (en) | Method of molding electronic parts | |
JPS5449926A (en) | Method of making mold | |
JPS5469167A (en) | Mold apparatus | |
JPS53118223A (en) | Mold molding method | |
JPS5456931A (en) | Vacuum molding and casting method for casting element | |
JPS5396555A (en) | Method of molding heatttransfer plate | |
JPS54163355A (en) | Mold method of electronic component | |
JPS53130773A (en) | Method and apparatus for making molding | |
JPS5435822A (en) | Method of making mold | |
JPS5428222A (en) | Method of making mold | |
JPS5423025A (en) | Method of making mold | |
JPS5491760A (en) | Case molding method of electronic equipment parts |