JPS5456566U - - Google Patents

Info

Publication number
JPS5456566U
JPS5456566U JP13089377U JP13089377U JPS5456566U JP S5456566 U JPS5456566 U JP S5456566U JP 13089377 U JP13089377 U JP 13089377U JP 13089377 U JP13089377 U JP 13089377U JP S5456566 U JPS5456566 U JP S5456566U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13089377U
Other languages
Japanese (ja)
Other versions
JPS5631871Y2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1977130893U priority Critical patent/JPS5631871Y2/ja
Publication of JPS5456566U publication Critical patent/JPS5456566U/ja
Application granted granted Critical
Publication of JPS5631871Y2 publication Critical patent/JPS5631871Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
JP1977130893U 1977-09-28 1977-09-28 Expired JPS5631871Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1977130893U JPS5631871Y2 (enrdf_load_stackoverflow) 1977-09-28 1977-09-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1977130893U JPS5631871Y2 (enrdf_load_stackoverflow) 1977-09-28 1977-09-28

Publications (2)

Publication Number Publication Date
JPS5456566U true JPS5456566U (enrdf_load_stackoverflow) 1979-04-19
JPS5631871Y2 JPS5631871Y2 (enrdf_load_stackoverflow) 1981-07-29

Family

ID=29096948

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1977130893U Expired JPS5631871Y2 (enrdf_load_stackoverflow) 1977-09-28 1977-09-28

Country Status (1)

Country Link
JP (1) JPS5631871Y2 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63111633A (ja) * 1986-10-30 1988-05-16 Matsushita Electric Ind Co Ltd チップボンディング装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS502465A (enrdf_load_stackoverflow) * 1973-05-07 1975-01-11

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS502465A (enrdf_load_stackoverflow) * 1973-05-07 1975-01-11

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63111633A (ja) * 1986-10-30 1988-05-16 Matsushita Electric Ind Co Ltd チップボンディング装置

Also Published As

Publication number Publication date
JPS5631871Y2 (enrdf_load_stackoverflow) 1981-07-29

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