JPS5456566U - - Google Patents

Info

Publication number
JPS5456566U
JPS5456566U JP13089377U JP13089377U JPS5456566U JP S5456566 U JPS5456566 U JP S5456566U JP 13089377 U JP13089377 U JP 13089377U JP 13089377 U JP13089377 U JP 13089377U JP S5456566 U JPS5456566 U JP S5456566U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13089377U
Other languages
Japanese (ja)
Other versions
JPS5631871Y2 (OSRAM
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1977130893U priority Critical patent/JPS5631871Y2/ja
Publication of JPS5456566U publication Critical patent/JPS5456566U/ja
Application granted granted Critical
Publication of JPS5631871Y2 publication Critical patent/JPS5631871Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
JP1977130893U 1977-09-28 1977-09-28 Expired JPS5631871Y2 (OSRAM)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1977130893U JPS5631871Y2 (OSRAM) 1977-09-28 1977-09-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1977130893U JPS5631871Y2 (OSRAM) 1977-09-28 1977-09-28

Publications (2)

Publication Number Publication Date
JPS5456566U true JPS5456566U (OSRAM) 1979-04-19
JPS5631871Y2 JPS5631871Y2 (OSRAM) 1981-07-29

Family

ID=29096948

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1977130893U Expired JPS5631871Y2 (OSRAM) 1977-09-28 1977-09-28

Country Status (1)

Country Link
JP (1) JPS5631871Y2 (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63111633A (ja) * 1986-10-30 1988-05-16 Matsushita Electric Ind Co Ltd チップボンディング装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS502465A (OSRAM) * 1973-05-07 1975-01-11

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS502465A (OSRAM) * 1973-05-07 1975-01-11

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63111633A (ja) * 1986-10-30 1988-05-16 Matsushita Electric Ind Co Ltd チップボンディング装置

Also Published As

Publication number Publication date
JPS5631871Y2 (OSRAM) 1981-07-29

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