JPS5447831A - Solder hot dipping method - Google Patents
Solder hot dipping methodInfo
- Publication number
- JPS5447831A JPS5447831A JP11335877A JP11335877A JPS5447831A JP S5447831 A JPS5447831 A JP S5447831A JP 11335877 A JP11335877 A JP 11335877A JP 11335877 A JP11335877 A JP 11335877A JP S5447831 A JPS5447831 A JP S5447831A
- Authority
- JP
- Japan
- Prior art keywords
- oxide film
- work
- flux
- solder
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title abstract 4
- 238000007598 dipping method Methods 0.000 title abstract 2
- 230000004907 flux Effects 0.000 abstract 4
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 abstract 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 abstract 2
- 239000007788 liquid Substances 0.000 abstract 2
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 abstract 2
- 239000002253 acid Substances 0.000 abstract 1
- 235000019270 ammonium chloride Nutrition 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 238000005238 degreasing Methods 0.000 abstract 1
- 235000011167 hydrochloric acid Nutrition 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 150000003839 salts Chemical class 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 239000004094 surface-active agent Substances 0.000 abstract 1
- 235000005074 zinc chloride Nutrition 0.000 abstract 1
- 239000011592 zinc chloride Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/30—Fluxes or coverings on molten baths
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/003—Apparatus
- C23C2/0038—Apparatus characterised by the pre-treatment chambers located immediately upstream of the bath or occurring locally before the dipping process
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
- C23C2/024—Pretreatment of the material to be coated, e.g. for coating on selected surface areas by cleaning or etching
Abstract
PURPOSE:To make it possible to plate a work of poor solderability with solder in a reliable and simple manner in a short time by degreasing the work and dipping it in a flux liquid over a long time to simultaneously remove an oxide film on the surface of the work at the time of coating the flux. CONSTITUTION:For example, the lead of a semiconductor device such as IC is degreased and dipped in a treating liquid with a flux action based on an org. acid, an inorg. salt, etc. with the strong action of removing an oxide film, e.g. zinc chloride, ammonium chloride and hydrochloric acid, and contg. little surfactant. An oxide film on the surface of the lead can be thoroughly removed by the treatment at 50-80 deg.C for 30-60sec. Even if the flux does not stick partially to the bent portion, the corner, etc. of the lead, solder is assuredly sticked and unevenness in sticking does not occur since the oxide film has been thoroughly removed. By this method a work of poor solderability or of a complex shape can be plated with solder in a reliable and simple manner in a short time.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11335877A JPS5447831A (en) | 1977-09-22 | 1977-09-22 | Solder hot dipping method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11335877A JPS5447831A (en) | 1977-09-22 | 1977-09-22 | Solder hot dipping method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5447831A true JPS5447831A (en) | 1979-04-14 |
Family
ID=14610244
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11335877A Pending JPS5447831A (en) | 1977-09-22 | 1977-09-22 | Solder hot dipping method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5447831A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115216716A (en) * | 2022-05-30 | 2022-10-21 | 山东嘉隆新型材料有限公司 | High strength resistance to compression galvanized sheet |
-
1977
- 1977-09-22 JP JP11335877A patent/JPS5447831A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115216716A (en) * | 2022-05-30 | 2022-10-21 | 山东嘉隆新型材料有限公司 | High strength resistance to compression galvanized sheet |
| CN115216716B (en) * | 2022-05-30 | 2023-09-08 | 山东嘉隆新型材料有限公司 | High-strength compression-resistant galvanized plate |
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