JPS5447792A - Resin composition - Google Patents
Resin compositionInfo
- Publication number
- JPS5447792A JPS5447792A JP11429477A JP11429477A JPS5447792A JP S5447792 A JPS5447792 A JP S5447792A JP 11429477 A JP11429477 A JP 11429477A JP 11429477 A JP11429477 A JP 11429477A JP S5447792 A JPS5447792 A JP S5447792A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- butylphenol
- hardener
- sec
- heat resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Abstract
PURPOSE: A resin composition having improved solder heat resistance, adhesiveness to metal, electrical insulating properties, and flexibility, consisting of an unsaturated polyester resin, a specific resin, a hardener, and a hardening accelerator.
CONSTITUTION: (A) 100 parts by wt. of an unsaturated polyester resin is incorporated with (B) 1W80 parts by wt. of one or more types of compounds selected from the group consisting of acrylic acid, acrylic esters, di-sec-butylphenol, P-sec- butylphenol, polyacrylates, P-vinyl-phenol resins, xylene resin, phenolic resin, amino resins, chlorinated polyvinyl chloride, and chlorinated polyolefins, then a hardener and a hardening accelerator.
EFFECT: Surface electrical resistivity ≥1012ω and heat resistance, e.g. resistant to 30sec immersion in a solder bath at 260°C.
USE: Metal foil laminates for flexible printed wiring and coating compounds.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11429477A JPS5447792A (en) | 1977-09-21 | 1977-09-21 | Resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11429477A JPS5447792A (en) | 1977-09-21 | 1977-09-21 | Resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5447792A true JPS5447792A (en) | 1979-04-14 |
Family
ID=14634248
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11429477A Pending JPS5447792A (en) | 1977-09-21 | 1977-09-21 | Resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5447792A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59166519A (en) * | 1983-03-10 | 1984-09-19 | Kanegafuchi Chem Ind Co Ltd | Flame-retardant unsaturated polyester resin composition and molded article thereof |
| JPS59172555A (en) * | 1982-12-28 | 1984-09-29 | ヘミツシエ・ウエルケ・ヒユ−ルス・アクチエンゲゼルシヤフト | Use of unsaturated polyester in coating agent for metal surface coating as adhesion-improving additional binder |
| JPS60226571A (en) * | 1984-04-25 | 1985-11-11 | Hitachi Chem Co Ltd | Unsaturated polyester resin composition for putty |
| JP2006089680A (en) * | 2004-09-27 | 2006-04-06 | Hitachi Chem Co Ltd | Unsaturated polyester resin composition and putty coating |
-
1977
- 1977-09-21 JP JP11429477A patent/JPS5447792A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59172555A (en) * | 1982-12-28 | 1984-09-29 | ヘミツシエ・ウエルケ・ヒユ−ルス・アクチエンゲゼルシヤフト | Use of unsaturated polyester in coating agent for metal surface coating as adhesion-improving additional binder |
| JPS59166519A (en) * | 1983-03-10 | 1984-09-19 | Kanegafuchi Chem Ind Co Ltd | Flame-retardant unsaturated polyester resin composition and molded article thereof |
| JPS60226571A (en) * | 1984-04-25 | 1985-11-11 | Hitachi Chem Co Ltd | Unsaturated polyester resin composition for putty |
| JP2006089680A (en) * | 2004-09-27 | 2006-04-06 | Hitachi Chem Co Ltd | Unsaturated polyester resin composition and putty coating |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0148157A3 (en) | Printed circuit boards | |
| MY121120A (en) | Copper foil for printed wiring board having excellent chemical resistance and heat resistance | |
| JPS5447792A (en) | Resin composition | |
| JPS56147850A (en) | Resin composition with improved mechanical strength and coating property | |
| ES8305150A1 (en) | Plastic/metal laminates, cable shielding or armoring tapes, and electrical cables made therewith. | |
| DE3362458D1 (en) | Use of unsaturated polyesters as additional adhesive binders in coating compositions for metals | |
| JPS6450592A (en) | Super-heat dissipation type composite circuit board | |
| JPS546027A (en) | Flame-retardant coating composition | |
| JPS5491543A (en) | Adhesive for chemical plating | |
| JPS54138081A (en) | Metal clad laminate for printed circuit board, and its manufacturing | |
| JPS5410400A (en) | Curable composition | |
| JPS5687694A (en) | Manufacture of copper foil for printed circuit | |
| JPS5681382A (en) | Flame-retardant adhesive composition | |
| JPS54138082A (en) | Metal clad laminate for printed circuit board, and its manufacturing | |
| JPS5773056A (en) | Corrosion-resistant coating compound composition | |
| JPS5767195A (en) | Surface treated steel plate with high corrision resistance | |
| JPS56100676A (en) | Fluorine-base resin coating method | |
| JPS529030A (en) | Water-based resin composition for tentative corrosionproofing | |
| JP2898120B2 (en) | Coverlay film | |
| JPS5414499A (en) | Heat resistant resin composition | |
| JPS51123230A (en) | Inorganic composition for use in forming surface coating film | |
| KR940007139A (en) | Conductive paint and printed circuit board and flexible printed circuit formed body with electromagnetic shielding using the same | |
| JPS56163166A (en) | Electroconductive coating containing copper powder | |
| JPS55151073A (en) | Cover lay ink for printed circuit board | |
| JPS5650970A (en) | Coating resin composition |