JPS5432318B2 - - Google Patents
Info
- Publication number
- JPS5432318B2 JPS5432318B2 JP2656572A JP2656572A JPS5432318B2 JP S5432318 B2 JPS5432318 B2 JP S5432318B2 JP 2656572 A JP2656572 A JP 2656572A JP 2656572 A JP2656572 A JP 2656572A JP S5432318 B2 JPS5432318 B2 JP S5432318B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Led Device Packages (AREA)
- Led Devices (AREA)
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
- Optical Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2656572A JPS5432318B2 (en:Method) | 1972-03-17 | 1972-03-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2656572A JPS5432318B2 (en:Method) | 1972-03-17 | 1972-03-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4895783A JPS4895783A (en:Method) | 1973-12-07 |
| JPS5432318B2 true JPS5432318B2 (en:Method) | 1979-10-13 |
Family
ID=12197049
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2656572A Expired JPS5432318B2 (en:Method) | 1972-03-17 | 1972-03-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5432318B2 (en:Method) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5419829Y2 (en:Method) * | 1974-09-25 | 1979-07-20 | ||
| JPS5837997B2 (ja) * | 1976-04-20 | 1983-08-19 | 松下電器産業株式会社 | 半導体表示装置 |
| JPS55157277A (en) * | 1979-05-25 | 1980-12-06 | Fujitsu Ltd | Optical semiconductor device |
-
1972
- 1972-03-17 JP JP2656572A patent/JPS5432318B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4895783A (en:Method) | 1973-12-07 |